Device and method for manufacturing fiber assembly

    公开(公告)号:US11773513B2

    公开(公告)日:2023-10-03

    申请号:US17660643

    申请日:2022-04-26

    CPC分类号: D01D5/18 D01D4/02 D01D5/04

    摘要: A device for manufacturing a fiber assembly includes: a rotating body that has a cylindrical shape, and winds and holds a plurality of support sheets around an outer peripheral surface around a rotation axis of the rotating body; a plurality of supply nozzles arranged along a direction parallel to the rotation axis, the supply nozzles supplying a polymer material to be a material of fibers to the plurality of support sheets; a supply nozzle moving unit that relatively moves the plurality of supply nozzles in the direction parallel to the rotation axis of the rotating body, in which the rotating body is rotatable about the rotation axis to wind, on main surfaces of the plurality of support sheets, fibers obtained by naturally cooling or naturally drying the polymer material supplied from the plurality of supply nozzles, and the rotating body includes a plurality of guide members in an annular shape circumscribing the outer peripheral surface of the rotating body concentrically to regulate positions of the plurality of support sheets.

    Component-mounting device
    5.
    发明授权

    公开(公告)号:US10939599B2

    公开(公告)日:2021-03-02

    申请号:US16098900

    申请日:2017-05-25

    发明人: Kouji Ikeda

    IPC分类号: H05K13/04 H05K3/34

    摘要: A component-mounting device includes a mounting head, a discharging portion, and a paste receiving portion. The mounting head holds a component. The discharging portion applies paste by spraying to the component held by the mounting head. The paste receiving portion is provided on the mounting head and captures paste that has been discharged from the discharging portion and has failed to reach the component.

    Electronic component mounting device and dispenser

    公开(公告)号:US10653051B2

    公开(公告)日:2020-05-12

    申请号:US16084325

    申请日:2017-04-04

    发明人: Kouji Ikeda

    摘要: According to the present disclosure, an electronic component mounting device includes: a mounting head which picks up an electronic component from a part feeder, and transfers and mounts the electronic component on a board; a dispenser which applies a paste to a lower surface of the electronic component picked up by the mounting head, the paste being flied out from an ejection hole of the dispenser against gravity, the ejection hole opening upwardly; and a shield member which is disposed between the electronic component and the dispenser and has an opening above the ejection hole.

    Culture medium and method for producing culture medium

    公开(公告)号:US11186818B2

    公开(公告)日:2021-11-30

    申请号:US15901993

    申请日:2018-02-22

    摘要: Provided is a culture medium including fibers aligned in one direction, and a method for producing the same. The culture medium includes: a substrate; a frame body that includes a first surface, a second surface opposite therefrom, and one or more through holes extending from the first surface through the second surface, and that is mounted to the substrate such that the first surface is opposed thereto; a plurality of aligned fibers interposed between the substrate and the first surface; and a bonding portion that bonds the substrate, the plurality of aligned fibers, and the frame body, wherein at least a part of the plurality of aligned fibers is exposed from a first opening that is formed in the first surface by the through hole.