SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    固态成像装置及其制造方法

    公开(公告)号:US20150021731A1

    公开(公告)日:2015-01-22

    申请号:US14511737

    申请日:2014-10-10

    Abstract: The solid-state imaging device according to the present invention includes a semiconductor substrate including an imaging region and a peripheral circuit region, a wiring layer formed on the semiconductor substrate, a plurality of pixel electrodes arranged in a matrix on the wiring layer above the imaging region, a photoelectric conversion film formed on the wiring layer and the plurality of pixel electrodes above the imaging region, and an upper electrode formed on the photoelectric conversion film. The photoelectric conversion film has a laminated structure in which a plurality of well layers and a plurality of barrier layers are alternately laminated, the well layers made of a first semiconductor having a fundamental absorption edge in a wavelength region longer than a near-infrared light wavelength, and the barrier layers made of an insulator or a second semiconductor having a band gap wider than that of the first semiconductor.

    Abstract translation: 根据本发明的固态成像装置包括:半导体衬底,其包括成像区域和外围电路区域;形成在半导体衬底上的布线层;多个像素电极,其布置在阵列上方的矩阵中,高于成像 形成在配线层上的光电转换膜和成像区域上方的多个像素电极以及形成在光电转换膜上的上电极。 光电转换膜具有交替层叠多个阱层和多个势垒层的层叠结构,由具有比近红外光波长长的波长区域的基本吸收边缘的第一半导体构成的阱层 并且由具有比第一半导体宽的带隙的绝缘体或第二半导体制成的阻挡层。

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