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    MOUNT SUBSTRATE AND LED MODULE WITH THE SAME
    2.
    发明申请
    MOUNT SUBSTRATE AND LED MODULE WITH THE SAME 有权
    安装基板和LED模块

    公开(公告)号：US20160260878A1

    公开(公告)日：2016-09-08

    申请号：US15012133

    申请日：2016-02-01

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Kosuke TAKEHARA ,  Hisaki FUJITANI ,  Naoki TAGAMI ,  Toshiaki KURACHI

    IPC: H01L33/62 ,  H01L33/52 ,  H01L33/50

    CPC classification number: H01L33/62 ,  H01L33/50 ,  H01L33/505 ,  H01L33/52 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A mount substrate includes: an insulation substrate containing resin and glass; connection conductors formed on a surface of the insulation substrate; a first white resist layer that covers the connection conductors; and a second white resist layer that covers the first white resist. Each of the connection conductors includes a copper foil and a plating layer partly formed on the copper foil. The plating layer is formed of metal having oxidation-resistant and corrosion-resistant characteristics higher than those of copper. The first white resist layer is formed with first openings that respectively expose the plating layers of the connection conductors. The second white resist layer covers a periphery of each plating layer of the connection conductors in planar view.

    Abstract translation: 安装基板包括：包含树脂和玻璃的绝缘基板; 形成在所述绝缘基板的表面上的连接导体; 覆盖连接导体的第一白色抗蚀剂层; 以及覆盖第一白色抗蚀剂的第二白色抗蚀剂层。 每个连接导体包括铜箔和部分地形成在铜箔上的镀层。 镀层由具有比铜高的抗氧化性和耐腐蚀性的金属形成。 第一白色抗蚀剂层形成有分别暴露连接导体的镀层的第一开口。 第二白色抗蚀剂层在平面图中覆盖连接导体的每个镀层的周边。

    LIGHT-EMITTING DEVICE
    7.
    发明申请
    LIGHT-EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号：US20170077368A1

    公开(公告)日：2017-03-16

    申请号：US15258548

    申请日：2016-09-07

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Hisaki FUJITANI ,  Kenji SUGIURA ,  Naoki TAGAMI ,  Kosuke TAKEHARA

    IPC: H01L33/62 ,  H01L27/15 ,  H01L33/48 ,  H01L33/54

    Abstract: A light-emitting device includes: a board which is a resin board having an elongated shape; a conductive film formed on the board; and a plurality of LED elements disposed over the board. The plurality of LED elements include two adjacent LED elements arranged along a first direction. The conductive film includes (i) a first conductive part which electrically connects the two adjacent LED elements and at least a portion of which is located between the two adjacent LED elements and (ii) a second conductive part located on two outer sides of the first conductive part in a second direction intersecting the first direction. The second conductive part has a slit on each of the two outer sides of the first conductive part, and the slit extends in the second direction intersecting the longitudinal direction of the board.

    Abstract translation: 发光装置包括：作为具有细长形状的树脂板的板; 形成在板上的导电膜; 以及设置在所述板上的多个LED元件。 多个LED元件包括沿着第一方向布置的两个相邻的LED元件。 导电膜包括：（i）第一导电部分，其电连接两个相邻的LED元件，并且其至少一部分位于两个相邻的LED元件之间;以及（ii）第二导电部件，位于第一 导电部分在与第一方向相交的第二方向上。 第二导电部分在第一导电部分的两个外侧的每一个上具有狭缝，并且狭缝在与板的纵向相交的第二方向上延伸。

    LED MODULE
    8.
    发明申请
    LED MODULE 有权
    LED模块

    公开(公告)号：US20170040508A1

    公开(公告)日：2017-02-09

    申请号：US15220790

    申请日：2016-07-27

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Naoki TAGAMI ,  Masumi ABE ,  Hisaki FUJITANI ,  Kosuke TAKEHARA ,  Toshiaki KURACHI

    IPC: H01L33/54 ,  H01L33/48 ,  H01L33/62

    CPC classification number: H01L33/62 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers above the substrate; and an LED element mounted above the substrate. A content percentage of at least one of a phenyl group, an ester bond, and a carbon double bond in a second layer that is an uppermost layer of the plurality of layers is lower than a content percentage of the at least one of the phenyl group, the ester bond, and the carbon double bond in a first layer that is an underlying layer of the plurality of layers, the underlying layer being located below the uppermost layer.

    Abstract translation: 一种发光二极管（LED）模块，包括：基板; 抗蚀剂，其包括在所述基板上方的多个层; 以及安装在基板上方的LED元件。 作为多个层的最上层的第二层中的苯基，酯键和碳双键中的至少一个的含量百分比低于所述至少一个苯基的含量百分比 ，酯键和作为多个层的下层的第一层中的碳双键，下层位于最上层的下方。

    LED MODULE
    9.
    发明申请
    LED MODULE 有权
    LED模块

    公开(公告)号：US20160260871A1

    公开(公告)日：2016-09-08

    申请号：US15013457

    申请日：2016-02-02

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Kosuke TAKEHARA ,  Hisaki FUJITANI ,  Naoki TAGAMI

    IPC: H01L33/50 ,  H01L33/56 ,  H01L33/62

    CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05K1/0274 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.

    Abstract translation: LED模块包括安装板和LED芯片。 安装板包括：包括树脂和玻璃的绝缘基板; 第一导体，第二导​​体和第三导体; 和白色抗蚀剂层。 白色抗蚀剂层设置有分别暴露第一导体，第二导​​体和第三导体的第一开口，第二开口和至少一个第三开口。 LED模块还包括在LED芯片的厚度方向上设置在LED芯片和第三导体之间的波长转换层。 波长转换层包括由从LED芯片发射的第一光激发的荧光体颗粒，以发射具有大于第一光的波长的波长的第二光。

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