公开(公告)号：US10679920B2

公开(公告)日：2020-06-09

申请号：US16245168

申请日：2019-01-10

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hideki Niimi ,  Tatsuo Sasaoka

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L23/13

Abstract: A semiconductor device with small variations in high frequency characteristics by suppressing variations in impedance while maintaining high heat radiation is provided. The semiconductor device including a semiconductor package having two terminals, a wiring board having an opening at which the semiconductor package is positioned and having two electrodes connected to the two terminals and a heat sink fixing the semiconductor package in which a center of the semiconductor package is decentered with respect to a center of the opening is used. Also, the semiconductor device in which a center of the two electrodes is decentered from a center of the opening is used.

公开(公告)号：US11134561B2

公开(公告)日：2021-09-28

申请号：US16796023

申请日：2020-02-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hideki Niimi ,  Shinji Takano

IPC: H01L23/40 ,  H05K1/02 ,  H05K3/34 ,  H05K7/20

Abstract: A wiring board includes a rod-shaped shaft member including at one end a flange that has a larger diameter than any other portion, a heat-releasing plate including a first through-hole in which the shaft member is inserted, and a board including a second through-hole in which the shaft member is inserted. In the wiring board, a gap is formed at least in part between the heat-releasing plate and the board.