Invention Grant
- Patent Title: Semiconductor device having semiconductor package in a wiring board opening
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Application No.: US16245168Application Date: 2019-01-10
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Publication No.: US10679920B2Publication Date: 2020-06-09
- Inventor: Hideki Niimi , Tatsuo Sasaoka
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Weneroth, Lind & Ponack, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@222b9f9f com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@477e558c
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/00 ; H01L23/498 ; H01L23/13
Abstract:
A semiconductor device with small variations in high frequency characteristics by suppressing variations in impedance while maintaining high heat radiation is provided. The semiconductor device including a semiconductor package having two terminals, a wiring board having an opening at which the semiconductor package is positioned and having two electrodes connected to the two terminals and a heat sink fixing the semiconductor package in which a center of the semiconductor package is decentered with respect to a center of the opening is used. Also, the semiconductor device in which a center of the two electrodes is decentered from a center of the opening is used.
Public/Granted literature
- US20190229029A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-07-25
Information query
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