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公开(公告)号：US20240090183A1
公开(公告)日：2024-03-14
申请号：US18516788
申请日：2023-11-21
Inventor： Atsushi YAMASHIMA , Shinya KIMURA
IPC: H05K7/20
CPC classification number: H05K7/209 , H05K7/20409 , H05K7/20445 , H05K7/20509 , H02M3/003
Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.
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公开(公告)号：US20210183735A1
公开(公告)日：2021-06-17
申请号：US17111935
申请日：2020-12-04
Inventor： Atsushi YAMASHIMA
Abstract: A power conversion apparatus includes a case having a heat-dissipation property, and including a housing part formed to surround a predetermined space, a resin material having a thermal conductivity, the resin material being provided in the predetermined space, a coil disposed in the predetermined space, a coil case having a shape that fits with the housing part, the coil case being configured to house the coil, and a power semiconductor device disposed along a side wall of the coil case. The power semiconductor device is pressed and fixed between a side wall of the housing part and the side wall of the coil case in a state where a heat dissipation surface is in contact with the side wall of the housing part.
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Patent Agency Ranking
公开(公告)号：US20210037675A1
公开(公告)日：2021-02-04
申请号：US17072917
申请日：2020-10-16
Inventor： Atsushi YAMASHIMA , Shinya KIMURA
IPC: H05K7/20
Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.
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公开(公告)号：US20240282493A1
公开(公告)日：2024-08-22
申请号：US18424416
申请日：2024-01-26
Inventor： Atsushi YAMASHIMA , Akitaka YOSHIKAWA
Abstract: An integrally-molded coil according to the present disclosure includes a coil portion and a resin portion. The resin portion is formed by molding a resin material having electrical insulation and thermal conductivity using the coil portion as an insert. The coil portion includes a coil main body and one or more pairs of leads each extending from the coil main body to an outside of the resin portion. An outer surface of the resin portion is applied with a surface treatment for imparting electrical conductivity, and is insulated from the one or more pairs of leads.
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公开(公告)号：US20240055192A1
公开(公告)日：2024-02-15
申请号：US18363409
申请日：2023-08-01
Inventor： Atsushi YAMASHIMA , Kentaro HAMASAKI , Kei TAKAHASHI , Yusuke SATO
Abstract: Provided is an electrolytic capacitor including: a plurality of capacitor elements; a plurality of storers that stores the plurality of capacitor elements, respectively; and a sealer that seals the plurality of capacitor elements in the plurality of storers. The plurality of storers is integrally formed.
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公开(公告)号：US20230034324A1
公开(公告)日：2023-02-02
申请号：US17870666
申请日：2022-07-21
Inventor： Atsushi YAMASHIMA , Daisuke OHMORI , Kei TAKAHASHI
Abstract: An inter-component connection structure includes a male fitting member; and a female fitting member that has a first nipping portion and a second nipping portion disposed to face each other, and nips an insertion portion of the male fitting member inserted between the first nipping portion and the second nipping portion. A pair of the male fitting member and the female fitting member is disposed in different components. The first nipping portion and the second nipping portion are respectively bent to form protruding portions toward surfaces thereof facing each other. A gap is provided at a tip portion of each of the first nipping portion and the second nipping portion. In at least one of the pair of the male fitting member and the female fitting member, an insulating portion is provided in a region that is not in contact with the other when fitted.
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公开(公告)号：US20220256730A1
公开(公告)日：2022-08-11
申请号：US17724345
申请日：2022-04-19
Inventor： Atsushi YAMASHIMA , Shinya KIMURA
IPC: H05K7/20
Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.
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