公开(公告)号：US20190067852A1

公开(公告)日：2019-02-28

申请号：US16034152

申请日：2018-07-12

申请人： PEGATRON CORPORATION

发明人： Yu-Ti Kuo ,  Yen-Hsing Chu ,  Chien-Yi Lee ,  Ching-Jen Wang

IPC分类号： H01R12/71 ,  H01R4/56 ,  H01R4/66

CPC分类号： H01R12/714 ,  H01R4/56 ,  H01R4/66 ,  H01R13/6485

摘要： An electronic device includes a ground element, a conductive assembly, a circuit board, an insulating element and a conductive element. The conductive assembly includes a base and a screw element. The base is disposed at the ground element and contacts the ground element. The screw element has a fixing portion and a clamping portion connected to the fixing portion. The outer diameter of the clamping portion is larger than the outer diameter of the fixing portion, and the fixing portion is fixed to the base. The circuit board is disposed between the base and the clamping portion of the screw element. The insulating element is disposed between part of the clamping portion and the circuit board. The conductive element is disposed at the circuit board and contacts the conductive assembly. The circuit board is electrically connected to the ground element through the conductive element and the conductive assembly.

公开(公告)号：US10530080B2

公开(公告)日：2020-01-07

申请号：US16034152

申请日：2018-07-12

申请人： PEGATRON CORPORATION

发明人： Yu-Ti Kuo ,  Yen-Hsing Chu ,  Chien-Yi Lee ,  Ching-Jen Wang

IPC分类号： H01R12/71 ,  H01R13/648 ,  H01R4/66 ,  H01R4/56

摘要： An electronic device includes a ground element, a conductive assembly, a circuit board, an insulating element and a conductive element. The conductive assembly includes a base and a screw element. The base is disposed at the ground element and contacts the ground element. The screw element has a fixing portion and a clamping portion connected to the fixing portion. The outer diameter of the clamping portion is larger than the outer diameter of the fixing portion, and the fixing portion is fixed to the base. The circuit board is disposed between the base and the clamping portion of the screw element. The insulating element is disposed between part of the clamping portion and the circuit board. The conductive element is disposed at the circuit board and contacts the conductive assembly. The circuit board is electrically connected to the ground element through the conductive element and the conductive assembly.