SEMICONDUCTOR DEVICE AND SEMICONDUCTOR RELAY USING SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR RELAY USING SAME 审中-公开
    使用相同的半导体器件和半导体继电器

    公开(公告)号:US20160226486A1

    公开(公告)日:2016-08-04

    申请号:US15022443

    申请日:2014-09-16

    CPC classification number: H03K17/689 H01L27/0207 H01L27/0676

    Abstract: A semiconductor device includes an input circuit, an output circuit, an insulation circuit, and a semiconductor substrate. The insulation circuit includes at least one capacitor for electrically insulating the input circuit and the output circuit from each other. The at least one capacitor has two electrodes, one of which being electrically connected to the input circuit, and the other of which being electrically connected to the output circuit. The semiconductor device further includes an insulation film that is made of dielectric material and is provided between the at least one capacitor and the semiconductor substrate in a thickness direction of the semiconductor substrate.

    Abstract translation: 半导体器件包括输入电路,输出电路,绝缘电路和半导体衬底。 绝缘电路包括用于将输入电路和输出电路彼此电绝缘的至少一个电容器。 至少一个电容器具有两个电极,其中一个电极电连接到输入电路,另一个电连接到输出电路。 半导体器件还包括由绝缘材料制成的绝缘膜,并且在半导体衬底的厚度方向上设置在至少一个电容器和半导体衬底之间。

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