公开(公告)号：US09611114B2

公开(公告)日：2017-04-04

申请号：US14552906

申请日：2014-11-25

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Junkei Shimizu ,  Kazunori Kanai ,  Masayuki Higashi ,  Tatsuo Yamamura

IPC: B65H20/20 ,  H05K13/04

CPC classification number: B65H20/20 ,  H05K13/0417 ,  H05K13/0419

Abstract: There is provided a tape feeder that feeds a carrier tape to supply components to a component suction position for a mounting head in a component mounting apparatus. The tape feeder includes a first tape feed mechanism which is provided in a downstream side and feeds a preceding tape to the component suction position, and a second tape feed mechanism provided in an upstream side and feeds a following tape from a tape introducing port side toward the first tape feed mechanism. The tape feeder also includes a tape slipping-off informing unit which informs the component mounting apparatus that the following tape is slipped off from the second tape feed mechanism. For example, the tape slipping-off informing unit decides that the following tape is slipped off when a rotation of a sprocket of the second tape feed mechanism in an opposite direction is detected.

公开(公告)号：US10863657B2

公开(公告)日：2020-12-08

申请号：US14768912

申请日：2014-02-20

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Masayuki Higashi ,  Taisuke Mori ,  Ryouji Kouchi ,  Takuya Yamazaki ,  Hisashi Maezono ,  Hiroshi Ando

IPC: H05K13/00 ,  B65G15/12 ,  B65G15/24 ,  B65G15/22 ,  H05K13/08

Abstract: An electronic component mounting method is performed by an electronic component mounting system including a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of boards different in mounting workload. The component mounting units includes: first and second board conveyance mechanisms; a component mounting unit; a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit. The electronic component mounting method comprises mixedly distributing the two kinds of the boards to each of the first and second board conveyance mechanisms based on a board request signal issued from a most-upstream component mounting unit in the component mounting line.

公开(公告)号：US09668394B2

公开(公告)日：2017-05-30

申请号：US14632279

申请日：2015-02-26

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Masayuki Higashi

IPC: H05K3/30 ,  H05K13/08 ,  H05K3/34

CPC classification number: H05K13/08 ,  H05K3/34 ,  H05K13/085 ,  H05K13/0853 ,  H05K2201/09972 ,  H05K2203/1476 ,  Y10T29/49137 ,  Y10T29/53174

Abstract: A component mounting system makes a mounting head to which a component holder is attached perform component mounting operation including upward and downward movement operation with respect to a board and mounts a component on the board. A mounting apparatus repeats reciprocating mounting operations in which the component holder is moved in a mounting order relative to a reference line extending in a first direction being the board conveyance direction such that that the component holder is advanced over the board in a second direction orthogonal to the first direction and then a held high-height component is mounted and thereafter the component holder is retracted from the board in the second direction. The mounting order is set in order in which a mounting coordinate of the high-height component is larger in the second direction relative to the reference line.