公开(公告)号：US20240347385A1

公开(公告)日：2024-10-17

申请号：US18138616

申请日：2023-04-24

Applicant: PAMTEK Co., Ltd.

Inventor： Jae Woong KIM ,  Jung In PARK ,  Jun Young YEOM ,  Jeong HEO ,  Je Hee RYU

IPC: H01L21/82 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683

CPC classification number: H01L21/82 ,  H01L21/3043 ,  H01L21/68 ,  H01L21/6836 ,  H01L21/6838

Abstract: A semiconductor wafer sample pre-processing system improves productivity and process reliability by automating all process from cutting a into a plurality of wafer samples through polishing of the wafer samples.