公开(公告)号：US20190027531A1

公开(公告)日：2019-01-24

申请号：US15654271

申请日：2017-07-19

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang ,  Yu-Mei Su

IPC: H01L27/146 ,  H04N1/03 ,  H04N5/225

Abstract: An image sensor module comprises: a substrate having a first side and second side, the first side being an opposite of the second side, an image sensor attached to the first side of the substrate, bonding wires to bond the image sensor to pads on the first side of the substrate, a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads, the protective structure having a dam and a lid, a cover glass disposed on the protective structure, and a set of solder balls attached to the second side of the substrate.