公开(公告)号：US09781362B1

公开(公告)日：2017-10-03

申请号：US15076911

申请日：2016-03-22

Applicant: OmniVision Technologies, Inc.

Inventor： Chao-Hung Lin ,  Hong Jun Li ,  Ping-Hsu Chen ,  Denis Chu

IPC: H04N3/14 ,  H04N5/335 ,  H04N5/225 ,  H04N5/357 ,  H01L27/146

CPC classification number: H04N5/3572 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14632

Abstract: An image sensor capable of capturing an image formed by a lens includes a substrate and a bonding wire. The substrate has a pixel array and a bonding pad on a top surface of the substrate between the pixel array and a substrate edge. The bonding wire is electrically connected to the bonding pad and has a region forming a non-zero angle with respect to the substrate top surface. The non-zero angle is in at least one of a lower and an upper angular range for minimizing reflection of incident light on the region from reaching the image sensor. The lower angular range is selected such that the region reflects the incident light away from the pixel array toward a plane including the lens. The upper angular range is selected such that the region reflects the incident light to a clearance between the bonding pad and the pixel array.

公开(公告)号：US20170280075A1

公开(公告)日：2017-09-28

申请号：US15076911

申请日：2016-03-22

Applicant: OmniVision Technologies, Inc.

Inventor： Chao-Hung Lin ,  Hong Jun Li ,  Ping-Hsu Chen ,  Denis Chu

IPC: H04N5/357 ,  H01L27/146

CPC classification number: H04N5/3572 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14632

Abstract: An image sensor capable of capturing an image formed by a lens includes a substrate and a bonding wire. The substrate has a pixel array and a bonding pad on a top surface of the substrate between the pixel array and a substrate edge. The bonding wire is electrically connected to the bonding pad and has a region forming a non-zero angle with respect to the substrate top surface. The non-zero angle is in at least one of a lower and an upper angular range for minimizing reflection of incident light on the region from reaching the image sensor. The lower angular range is selected such that the region reflects the incident light away from the pixel array toward a plane including the lens. The upper angular range is selected such that the region reflects the incident light to a clearance between the bonding pad and the pixel array.