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公开(公告)号:US10834347B2
公开(公告)日:2020-11-10
申请号:US16133449
申请日:2018-09-17
Applicant: OmniVision Technologies, Inc.
Inventor: Taehyung Jung , Hoon Ryu , Zheng Yang , Hyunsu Yoon , Chia-Ming Chen
IPC: H04N5/3745 , H04N5/369 , H01L27/146
Abstract: A multiple IC, buffered, image sensor has a first IC with pixels, selection transistors, and interconnect coupling selected pixels with first inter-die bond pads that convey image data to a second IC having logic and ADCs. The ADCs having inputs coupled to selected pixels and outputting through-silicon vias and inter-die bond pads to a third IC coupled to buffer raw image data in DRAM. A method includes capturing images with array pixel IC divided into sub-arrays each coupled to a separate, associated, ADC through inter-die bonds, scanning the sub-arrays and converting the image data to digital image data; and transferring the digital image data over inter-die bonds into buffers in DRAM.
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公开(公告)号:US10735682B2
公开(公告)日:2020-08-04
申请号:US16191041
申请日:2018-11-14
Applicant: OmniVision Technologies, Inc.
Inventor: Chia-Ming Chen , Jong-sik Na
IPC: H04N5/3745 , H04N5/378 , H04N5/376
Abstract: An image sensor has multiple blocks each with multiple pixels; each block uses a separate analog-to-digital converter (ADC). The ADCs feed digitized images into an image DRAM, and the image DRAM feeds digitized images to an alignment buffer in turn providing images to an image processor. The ADCs feed digitized image data into the image DRAM in hyperlong words, using staggered, overlapping, word lines to write each hyperlong word. A method of imaging includes exposing a photosensor array to light, reading pixels of the array in sequence within each block of pixels, one pixel in each block simultaneously; and digitizing pixels in separate ADCs for each block. Digitized pixels are written to image DRAM as hyperlong words with one pixel from each block in parallel using staggered, overlapping, word lines. Pixels are read from the image DRAM into an alignment buffer and thence to the image processor.
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