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公开(公告)号：US20230327394A1
公开(公告)日：2023-10-12
申请号：US18005876
申请日：2021-07-15
发明人： Jörg Erich SORG , Roland HUETTINGER , Matthias HOFMANN , Steffen STRAUSS , Herbert BRUNNER , Ralph WAGNER
IPC分类号： H01S5/02257 , H01S5/02224
CPC分类号： H01S5/02257 , H01S5/02224 , H01S5/4093
摘要： In one embodiment, the optoelectronic semiconductor component includes at least one optoelectronic semiconductor chip for generating radiation and a housing, in which the at least one optoelectronic semiconductor chip is hermetically encapsulated. The housing includes a housing cover which is secured to a housing main part by a connection means. The housing additionally includes a gas exchange channel which is hermetically sealed by a seal.
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公开(公告)号：US20230042041A1
公开(公告)日：2023-02-09
申请号：US17792679
申请日：2020-12-18
发明人： Karlheinz ARNDT , Matthias GOLDBACH , Simon JEREBIC , Matthias HOFMANN , Markus BOSS , Constantin HETZER , Harald JAEGER , Jens EBERHARD , Sebastian STOLL
摘要： The Invention relates to a housing for an optoelectronic semiconductor component, comprising: a housing main body, which has a chip mounting side, at least two electrical conducting structures in and/or on the housing main body, and a plurality of drainage structures on the chip mounting side. The electrical conducting structures form, on the chip mounting side, electrical contact surfaces for at least one optoelectronic semiconductor chip and the drainage structure are designed as means for feeding a liquid potting material to the electrical contact surfaces.
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