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    Method for producing an optoelectronic component and optoelectronic component
    3.
    发明授权
    Method for producing an optoelectronic component and optoelectronic component 有权

    公开(公告)号：US10854788B2

    公开(公告)日：2020-12-01

    申请号：US16311676

    申请日：2017-07-06

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Choo Kean Lim ,  Choon Keat Or ,  Choon Kim Lim ,  Ai Cheng Chan

    IPC分类号： H01L33/48 ,  H01L21/683 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62

    摘要： An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a method includes attaching a plurality of optoelectronic semiconductor chips on predetermined locations of an intermediate film, providing a cavity film with a plurality of separated openings, attaching the cavity film to the intermediate film such that each optoelectronic semiconductor chip is associated with a respective opening, wherein the cavity film is thicker than the optoelectronic semiconductor chips such that the cavity film exceeds the optoelectronic semiconductor chips in a direction away from the intermediate film, filling a casting material in each of the openings such that the optoelectronic semiconductor chips are casted with the casting material and removing the intermediate film.

    Light Apparatus
    5.
    发明申请
    Light Apparatus 审中-公开
    灯具

    公开(公告)号：US20160186976A1

    公开(公告)日：2016-06-30

    申请号：US14911765

    申请日：2013-08-13

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Kok Eng Ng ,  Choo Kean Lim ,  Eu Liong Ong ,  Boon Liang Yap

    IPC分类号： F21V29/15 ,  F21V29/70 ,  F21V17/10

    CPC分类号： F21V29/15 ,  F21V17/101 ,  F21V29/70 ,  F21Y2115/10

    摘要： A light apparatus is disclosed. Embodiments of the light apparatus includes a first carrier with at least one electronic component for controlling an optoelectronic component, a second carrier with the optoelectronic component for generating electromagnetic radiation and a thermally insulating layer arranged between the first and second carriers, wherein the first and second carriers are attached to the insulating layer.

    摘要翻译： 公开了一种灯装置。 光装置的实施例包括具有至少一个用于控制光电子部件的电子部件的第一载体，具有用于产生电磁辐射的光电子部件的第二载体和布置在第一和第二载体之间的绝热层，其中第一和第二载体 载体附着到绝缘层。

    ELECTRONIC DEVICE
    7.
    发明申请
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20180226555A1

    公开(公告)日：2018-08-09

    申请号：US15750316

    申请日：2015-08-06

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Kok Eng Ng ,  Wui Chai Chew ,  Choo Kean Lim ,  Mardiana Khalid

    IPC分类号： H01L33/64 ,  H01L33/62 ,  H01L23/498 ,  H01L25/075 ,  H01L21/48 ,  H01L23/00 ,  H01L23/373 ,  H01L23/538

    摘要： An electronic device includes a carrier and a semiconductor chip, wherein the carrier includes a first dielectric layer and a second dielectric layer, a thermal conductivity of the first dielectric layer exceeds a thermal conductivity of the second dielectric layer, the second dielectric layer is arranged on the first dielectric layer and partially covers the first dielectric layer, the semiconductor chip is arranged on the carrier in a mounting area in which the first dielectric layer is not covered by the second dielectric layer, and the carrier includes a solder terminal for electrical contacting arranged on the second dielectric layer.

    METHOD OF PRODUCING A LARGE NUMBER OF SUPPORT APPARATUS WHICH CAN BE SURFACE-MOUNTED, ARRANGEMENT OF A LARGE NUMBER OF SUPPORT APPARATUS WHICH CAN BE SURFACE-MOUNTED, AND SUPPORT APPARATUS WHICH CAN BE SURFACE-MOUNTED
    9.
    发明申请
    METHOD OF PRODUCING A LARGE NUMBER OF SUPPORT APPARATUS WHICH CAN BE SURFACE-MOUNTED, ARRANGEMENT OF A LARGE NUMBER OF SUPPORT APPARATUS WHICH CAN BE SURFACE-MOUNTED, AND SUPPORT APPARATUS WHICH CAN BE SURFACE-MOUNTED 有权
    生产可以表面安装的大量支持装置的方法，可以安装大量支持装置的装置，以及可以被表面安装的支持装置

    公开(公告)号：US20160268186A1

    公开(公告)日：2016-09-15

    申请号：US15029693

    申请日：2013-10-17

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Choo Kean Lim ,  Chee Jia Chang ,  Choon Keat Or

    IPC分类号： H01L23/498 ,  H01L33/48 ,  H01L21/48 ,  H01L23/00

    CPC分类号： H01L23/49805 ,  H01L21/4846 ,  H01L21/4853 ,  H01L23/488 ,  H01L24/05 ,  H01L24/94 ,  H01L24/95 ,  H01L33/486 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2924/00

    摘要： A method of producing a multiplicity of surface-mountable carrier devices includes: A) providing a carrier plate having a first main face and a second main face located opposite the first main face, B) applying an electrically conductive layer to the first main face, C) applying a solder resist mask to a side of the electrically conductive layer remote from the carrier plate, wherein a multiplicity of adjoining regions are formed on the electrically conductive layer by the solder resist mask, D) applying a solder material to the solder resist mask and the electrically conductive layer, wherein the solder resist mask and the electrically conductive layer are at least partially covered by the solder material, and E) singulating the carrier plate and the electrically conductive layer along and through the solder resist mask and the solder material, wherein the solder material remains at least partially on the solder resist mask.

    摘要翻译： 一种制造多个可表面安装的载体装置的方法包括：A）提供具有第一主面和与第一主面相对的第二主面的承载板，B）向第一主面施加导电层， C）将阻焊掩模施加到远离载体板的导电层的一侧，其中通过阻焊掩模在导电层上形成多个相邻的区域，D）将焊料材料施加到阻焊层 掩模和所述导电层，其中所述阻焊掩模和所述导电层至少部分地被所述焊料材料覆盖，以及E）沿着所述阻焊掩模和所述焊料材料沿着所述阻焊掩模和所述焊料材料分割所述载体板和所述导电层 其中焊料材料至少部分保留在阻焊掩模上。

    Method for Producing Optoelectronic Semiconductor Devices and Optoelectronic Semiconductor Device
    10.
    发明申请
    Method for Producing Optoelectronic Semiconductor Devices and Optoelectronic Semiconductor Device 有权

    公开(公告)号：US20220165924A1

    公开(公告)日：2022-05-26

    申请号：US17434148

    申请日：2019-03-08

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： Choo Kean Lim ,  Xiao Fen Hoo ,  Wan Leng Lim ,  Ai Cheng Chan

    IPC分类号： H01L33/60 ,  H01L21/683 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58

    摘要： In an embodiment, a method for producing optoelectronic semiconductor devices includes applying a temporal spacer to protect a light-exit face of an optoelectronic semiconductor chip by applying a photoresist onto a first carrier, subsequently developing the photoresist in places thereby forming the temporal spacer and subsequently mounting the optoelectronic semiconductor chip onto a side of the temporal spacer facing away from the first carrier, forming a reflector in a lateral direction directly around the optoelectronic semiconductor chip and around the temporal spacer, subsequently removing the temporal spacer so that the reflector extends beyond the light-exit face and applying an optical element onto the reflector so that a gap exists between the light-exit face and a light-entrance face of the optical element.