公开(公告)号：US20240085251A1

公开(公告)日：2024-03-14

申请号：US18389381

申请日：2023-11-14

Applicant: Nitto Bend Technologies, Inc. ,  Nitto Denko Corporation

Inventor： Colton A. Ottley ,  Jared K. Jonas ,  Colin D. Eichinger ,  Nathan Grimes ,  Nathan C. Briggs

IPC: G01L1/14

CPC classification number: G01L1/142

Abstract: Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.