公开(公告)号：US11990394B2

公开(公告)日：2024-05-21

申请号：US17475612

申请日：2021-09-15

申请人： NEXPERIA B.V.

发明人： Kim Ng ,  On Lok Chau ,  Wai Keung Ho ,  Raymond Wong

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L23/31 ,  H01L23/532

CPC分类号： H01L23/49582 ,  H01L21/4821 ,  H01L23/31 ,  H01L23/53242

摘要： A semiconductor package including a lead frame, an Ag plated surface positioned on the lead frame, an adhesion promotion layer positioned on the top of the Ag plated surface, and mold body covering the top of the lead frame is provided. The Ag plated surface covers a significant part of an interconnection area of the lead frame surface, and the Ag plating surface does not exceed the area of the mold body.

公开(公告)号：US09847283B1

公开(公告)日：2017-12-19

申请号：US15344564

申请日：2016-11-06

申请人： Nexperia B.V.

发明人： Xue Ke ,  Kan Wae Lam ,  Sven Walczyk ,  Wai Keung Ho ,  Wing Onn Chaw

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/49555 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/49805 ,  H01L24/48 ,  H01L2224/48245 ,  H01L2224/48479 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/3841 ,  H01L2224/48471 ,  H01L2924/00012

摘要： A semiconductor device has wettable corner leads. A semiconductor die is mounted on a lead frame. Die bonding pads are electrically connected to leads of the lead frame. The die and electrical connections are encapsulated with a mold compound. The leads are exposed and flush with the corners of the device. The leads include dimples so that they are wettable, which facilitates inspection when the device is mounted on a circuit board or substrate.