ON-CHIP FAULT DETECTION DUE TO MALFUNCTIONS ON CHIP PINS

    公开(公告)号:US20240353479A1

    公开(公告)日:2024-10-24

    申请号:US18458382

    申请日:2023-08-30

    申请人: NXP USA, Inc.

    IPC分类号: G01R31/28 H03K3/037

    摘要: A first power supply pad is configured to provide a first power supply to a power domain of the SoC in which the first power supply pad is configured to receive the first power supply from a source external to the SoC. A first signal pad is configured to receive a power ready signal from external the SoC which indicates when the first power supply to the power domain is fully powered up. A first power detector is configured to provide a first power detected output, which, when asserted, indicates presence of a power supply voltage on the first power supply pad. A fault detection circuit coupled to the first power detector and the first signal pad is configured to generate a set of fault flags in response to monitoring a relationship between the first power detected output and a logic state of the power ready signal.