公开(公告)号：US20180228032A1

公开(公告)日：2018-08-09

申请号：US15749683

申请日：2017-05-01

Applicant: NISSAHA CO., LTD.

Inventor： Seiichi YAMAZAKI ,  Toshihiro IGA ,  Yasuisa TAKINISHI

IPC: H05K3/32 ,  B29C45/14 ,  B32B27/08 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/32 ,  B29C45/14 ,  B29C45/14016 ,  B29C45/14467 ,  B29C70/72 ,  B29C2045/14147 ,  B29C2045/14163 ,  B29C2045/14532 ,  B29C2045/1454 ,  B29K2995/0007 ,  B29L2031/34 ,  B32B27/08 ,  B32B2307/206 ,  B32B2457/00 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/115 ,  H05K1/189 ,  H05K3/0014 ,  H05K2201/09209 ,  H05K2203/1327

Abstract: [Object] To provide a molding with an integrated electrode pattern in which a band-shaped second film including an electric connecting portion to be connected to an external substrate can be securely fixed to an inner surface of a resin molded body, and to provide a method for manufacturing the molding with an integrated electrode pattern.[Solution] A molding with an integrated electrode pattern includes a resin molded body; a first film 11 that is formed on an inner surface of the resin molded body and that includes an electrode pattern 13 and a first lead-out wire 63 electrically connected to the electrode pattern; and a second film 4 that is band-shaped, that stands on the inner surface of the resin molded body, and that includes a second lead-out wire 15 electrically connected to the first lead-out wire. The resin molded body includes a pair of support wall portions 3 formed integrally with the inner surface of the resin molded body so as to stand on the inner surface of the resin molded body and clamp both ends of a base part 4a of the second film.