公开(公告)号：US20180203366A1

公开(公告)日：2018-07-19

申请号：US15921121

申请日：2018-03-14

Applicant: NIKON CORPORATION

Inventor： Hidemi KAWAI

IPC: G03F7/20 ,  B08B3/04 ,  B08B3/12

CPC classification number: G03F7/70341 ,  B08B3/04 ,  B08B3/12 ,  G03F7/70891 ,  G03F7/70916 ,  G03F7/70925

Abstract: In an immersion lithography apparatus, a projection optics having a final surface projects a pattern image onto a workpiece through a liquid immersion area between the final surface and an upper surface of the workpiece during an immersion lithography process in which the immersion liquid is supplied from above the workpiece via the liquid supply port and the supplied immersion liquid is collected from above the workpiece via the liquid recovery port. During a cleanup process, an object different from the workpiece is placed instead of the workpiece, a cleaning liquid is supplied onto the object from above the object via the liquid supply port, and the supplied cleaning liquid is collected from above the object via the recovery port. The cleaning liquid is not allowed to be used for projecting the pattern image.

公开(公告)号：US20220152751A1

公开(公告)日：2022-05-19

申请号：US17438756

申请日：2019-03-13

Applicant: NIKON CORPORATION

Inventor： Hidemi KAWAI

IPC: B23K37/00 ,  B23K26/12 ,  B23K26/08 ,  B23K26/70 ,  B23K26/342

Abstract: A processing system has: a housing in which an object is housed and that has a part through which light is allowed to pass; an irradiation apparatus that emits a processing beam for processing the object; a first member which an energy beam from the irradiation apparatus that propagates toward an outside of the housing through the part enters; and a second member which the energy beam through the first member enters, the first member reduces an intensity of the energy beam that enter the first member, the second member reduces an intensity of the energy beam that enters the second member from the first member.

公开(公告)号：US20250050417A1

公开(公告)日：2025-02-13

申请号：US18931553

申请日：2024-10-30

Applicant: NIKON CORPORATION

Inventor： Hidemi KAWAI

IPC: B22F10/25 ,  B22F10/00 ,  B22F10/14 ,  B22F10/28 ,  B22F10/31 ,  B22F10/32 ,  B22F12/45 ,  B22F12/90 ,  B29C64/153 ,  B29C64/393 ,  B33Y30/00 ,  B33Y50/02

Abstract: A processing system is provided with: a support apparatus that is configured to support a processing target; a processing apparatus that performs an additive processing by irradiating a processed area on the processing target with an energy beam and by supplying materials to an area that is irradiated with the energy beam; and a position change apparatus that changes a positional relationship between the support apparatus and an irradiation area of the energy beam from the processing apparatus, wherein the processing system forms a fiducial build object by performing the additive processing on at least one of a first area that is a part of the support apparatus and a second area that is a part of the processing target, and the processing system controls at least one of the processing apparatus and the position change apparatus by using an information relating to the fiducial build object.

公开(公告)号：US20210001403A1

公开(公告)日：2021-01-07

申请号：US16964909

申请日：2019-01-29

Applicant: NIKON CORPORATION

Inventor： Hidemi KAWAI

IPC: B22F3/105 ,  B33Y50/02 ,  B29C64/153 ,  B29C64/393 ,  B33Y30/00

Abstract: A processing system is provided with: a support apparatus that is configured to support a processing target; a processing apparatus that performs an additive processing by irradiating a processed area on the processing target with an energy beam and by supplying materials to an area that is irradiated with the energy beam; and a position change apparatus that changes a positional relationship between the support apparatus and an irradiation area of the energy beam from the processing apparatus, wherein the processing system forms a fiducial build object by performing the additive processing on at least one of a first area that is a part of the support apparatus and a second area that is a part of the processing target, and the processing system controls at least one of the processing apparatus and the position change apparatus by using an information relating to the fiducial build object.

公开(公告)号：US20140132939A1

公开(公告)日：2014-05-15

申请号：US14161072

申请日：2014-01-22

Applicant: NIKON CORPORATION

Inventor： Hidemi KAWAI ,  Douglas C. WATSON

IPC: G03F7/20

CPC classification number: G03F7/70341 ,  B08B3/04 ,  B08B3/12 ,  G03F7/70891 ,  G03F7/70916 ,  G03F7/70925

Abstract: An immersion lithography apparatus and method places an object for a cleanup process on a holder of a movable stage of the immersion lithography apparatus, a wafer being held on the holder of the stage and exposed during a liquid immersion lithography process. During the liquid immersion lithography process, device pattern projection is performed and a device pattern image is projected onto the wafer held on the holder to fabricate semiconductor devices. During the cleanup process, a liquid is supplied via a supply port from above the stage holding the object on the holder. During the cleanup process, the object is held on the holder in place of the wafer and the object is used without performing device pattern projection.

Abstract translation: 浸没式光刻设备和方法将用于清理处理的物体放置在浸没式光刻设备的可移动台的保持器上，晶片保持在台架上并在液浸式光刻工艺中曝光。 在液浸光刻工艺期间，执行器件图案投影并将器件图案图像投影到保持在保持器上的晶片上以制造半导体器件。 在净化过程中，通过供给口从保持物体上的台架上方供给液体。 在清理过程中，物体被保持在保持器上以代替晶片，并且使用物体而不执行设备图案投影。