An immersion lithography apparatus and method places an object for a cleanup process on a holder of a movable stage of the immersion lithography apparatus, a wafer being held on the holder of the stage and exposed during a liquid immersion lithography process. During the liquid immersion lithography process, device pattern projection is performed and a device pattern image is projected onto the wafer held on the holder to fabricate semiconductor devices. During the cleanup process, a liquid is supplied via a supply port from above the stage holding the object on the holder. During the cleanup process, the object is held on the holder in place of the wafer and the object is used without performing device pattern projection.