公开(公告)号：US20230160691A1

公开(公告)日：2023-05-25

申请号：US18152791

申请日：2023-01-11

Applicant: NIDEC READ CORPORATION

Inventor： Alexsandr JUK ,  Alain ROSS ,  Takashi MIYASAKA ,  Takeya TSUKAMOTO ,  Shigeya KIKUTA

IPC: G01B11/25 ,  G06T7/00 ,  H04N23/56

CPC classification number: G01B11/2522 ,  G06T7/0004 ,  H04N23/56 ,  G06T2207/30148

Abstract: A bump inspection device images a wafer that includes a plurality of bumps arranged in parallel to each other. Each of the bumps is elongated along a first direction that is along a substrate surface. The bump inspection device includes: a laser-light source that emits laser light in a direction that is inclined relative to the substrate surface; a camera that images the substrate surface onto which the laser light is emitted; and a direction adjusting portion that adjusts an arrangement relation between the direction in which the laser light is emitted and an orientation of the wafer to allow the first direction to become inclined relative to the direction in which the laser light is emitted, in a plan view. The camera images the wafer while the first direction is inclined relative to the direction in which the laser light is emitted, in a plan view.

公开(公告)号：US20200166334A1

公开(公告)日：2020-05-28

申请号：US16631844

申请日：2017-12-26

Applicant: NIDEC READ CORPORATION

Inventor： Alexsandr JUK ,  Alain ROSS ,  Takashi MIYASAKA ,  Takeya TSUKAMOTO ,  Shigeya KIKUTA

IPC: G01B11/25 ,  H04N5/225 ,  G06T7/00

Abstract: A bump inspection device images a wafer that includes a plurality of bumps arranged in parallel to each other. Each of the bumps is elongated along a first direction that is along a substrate surface. The bump inspection device includes: a laser-light source that emits laser light in a direction that is inclined relative to the substrate surface; a camera that images the substrate surface onto which the laser light is emitted; and a direction adjusting portion that adjusts an arrangement relation between the direction in which the laser light is emitted and an orientation of the wafer to allow the first direction to become inclined relative to the direction in which the laser light is emitted, in a plan view. The camera images the wafer while the first direction is inclined relative to the direction in which the laser light is emitted, in a plan view.