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公开(公告)号:US20220357027A1
公开(公告)日:2022-11-10
申请号:US17624081
申请日:2020-07-09
Applicant: NGK SPARK PLUG CO., LTD.
Inventor: Yosuke YATSUYA , Ryuichi ARAKAWA , Toshiyuki SAKURAI , Tomoo TANAKA
IPC: F21V29/503 , F21V9/32
Abstract: A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.
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公开(公告)号:US20230383926A1
公开(公告)日:2023-11-30
申请号:US18245275
申请日:2021-12-13
Applicant: NGK SPARK PLUG CO., LTD.
Inventor: Yosuke YATSUYA , Toshiyuki SAKURAI , Shohei TAKAKU , Hiroki YAMAUCHI , Tomoo TANAKA , Hiroki TAKEUCHI , Shinji BAN
Abstract: There is provided a wavelength conversion member including: a fluorescent body and a reflective film. The fluorescent body is configured to emit fluorescence by an excitation light and has an incident surface into which the excitation light comes and a rear surface which faces the incident surface. The reflective film is arranged on a side of the rear surface of the fluorescent body and includes a metal layer and ceramic particles dispersed in the metal layer. The ceramic particles are crystalline, and a melting point of the ceramic particles is higher than a melting point of a metal constructing the metal layer.
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公开(公告)号:US20220347781A1
公开(公告)日:2022-11-03
申请号:US17624001
申请日:2020-07-09
Applicant: NGK SPARK PLUG CO., LTD.
Inventor: Yosuke YATSUYA , Ryuichi ARAKAWA , Toshiyuki SAKURAI , Tsuneyuki ITO , Hiroki TAKEUCHI , Tomoo TANAKA , Yusuke KATSU
IPC: B23K3/08
Abstract: A wavelength conversion member for soldering includes a ceramic fluorescent body for converting a wavelength of light entering from an incident surface of the ceramic fluorescent body, a reflection layer disposed on a back surface of the ceramic fluorescent body on a side opposite the incident surface and partially or entirely covering the back surface, and a junction layer composed of one or more films and covering at least the reflection layer selected from the back surface of the ceramic fluorescent body and the reflection layer. The junction layer has a projecting portion which projects, in relation to an outer circumferential portion of the junction layer, in a center portion of a surface on a side opposite a surface on a side where the junction layer covers at least the reflection layer selected from the back surface and the reflection layer.
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