BONDED BODY AND ACOUSTIC WAVE ELEMENT

    公开(公告)号:US20210234530A1

    公开(公告)日:2021-07-29

    申请号:US17231429

    申请日:2021-04-15

    IPC分类号: H03H9/02 H03H3/08

    摘要: A bonded body includes a supporting substrate; a piezoelectric material substrate; a first bonding layer provided on the supporting substrate and having a composition of Si(1-x)Ox (0.008≤x≤0.408); a second bonding layer provided on the piezoelectric material substrate and having a composition of Si(1-y)Oy (0.008≤y≤0.408); and an amorphous layer provided between the first bonding layer and second bonding layer. The oxygen ratio of the amorphous layer is higher than the oxygen ratio of the first bonding layer and oxygen ratio of the second bonding layer.

    BONDED BODY AND ELASTIC WAVE ELEMENT

    公开(公告)号:US20210111698A1

    公开(公告)日:2021-04-15

    申请号:US17128724

    申请日:2020-12-21

    摘要: A bonded body includes: a piezoelectric single crystal substrate; a supporting substrate composed of a single crystal silicon; a bonding layer provided between the supporting substrate and piezoelectric single crystal substrate and having a composition of Si(1-x)Ox (0.008≤x≤0.408); and an amorphous layer provided between the supporting substrate and bonding layer and containing silicon atoms, oxygen atoms and argon atoms. The concentration of the oxygen atoms in an end part of the amorphous layer on a side of the bonding layer is higher than the average concentration of the oxygen atoms in the bonding layer.

    COMPOSITE SUBSTRATE FOR ELECTRO-OPTIC ELEMENT AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20220004030A1

    公开(公告)日:2022-01-06

    申请号:US17480870

    申请日:2021-09-21

    IPC分类号: G02F1/035

    摘要: A composite substrate for an electro-optic element is disclosed. The composite substrate includes: an electro-optic crystal substrate having an electro-optic effect; a low-refractive-index layer being in contact with the electro-optic crystal substrate and having a lower refractive index than the electro-optical crystal substrate; and a support substrate bonded to the low-refractive-index layer at least via a bonding layer. A plurality of interfaces located between the low-refractive-index layer and the support substrate includes at least one rough interface having a roughness that is larger than a roughness of an interface between the electro-optic crystal substrate and the low-refractive-index layer.

    JOINED BODY OF PIEZOELECTRIC MATERIAL SUBSTRATE AND SUPPORT SUBSTRATE

    公开(公告)号:US20200373905A1

    公开(公告)日:2020-11-26

    申请号:US16991699

    申请日:2020-08-12

    摘要: A bonded body includes a supporting substrate, a piezoelectric material substrate composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate, and an amorphous layer present between the supporting substrate and piezoelectric material substrate. The amorphous layer contains one or more metal element selected from the group consisting of niobium and tantalum, an element constituting the supporting substrate and oxygen element. The concentration of the metal element in the amorphous layer is higher than the concentration of oxygen element and 20 to 65 atom %.

    ELASTIC WAVE ELEMENT AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:US20200067480A1

    公开(公告)日:2020-02-27

    申请号:US16670462

    申请日:2019-10-31

    摘要: In an acoustic wave device including a piezoelectric material substrate and supporting body bonded with each other through a bonding layer, it is an object to provide the acoustic wave device having the structure for further improving the propagation loss and temperature characteristics of frequency of an acoustic wave. An acoustic wave device includes a piezoelectric material substrate, an electrode on the piezoelectric material substrate, a supporting body, and a bonding layer for bonding the piezoelectric material substrate and the supporting body. The bonding layer is composed of quartz crystal.

    BONDED BODIES AND ACOUSTIC WAVE DEVICES
    7.
    发明申请

    公开(公告)号:US20190007022A1

    公开(公告)日:2019-01-03

    申请号:US16102209

    申请日:2018-08-13

    摘要: An object is to improve insulation in a bonding layer and to improve a bonding strength of a supporting body and piezoelectric single crystal substrate, in a bonded body having the supporting body made of a polycrystalline material or single crystal material, the piezoelectric single crystal substrate and the bonding layer provided between the supporting body and piezoelectric single crystal substrate.The bonded body includes the supporting body, piezoelectric single crystal substrate and the bonding layer provided between the supporting body and piezoelectric single crystal substrate. The bonding layer has a composition of Si(1-x)Ox (0.008≤x≤0.408).

    VIBRATING PLATE-BONDED-BODY
    9.
    发明申请

    公开(公告)号:US20220393094A9

    公开(公告)日:2022-12-08

    申请号:US17452491

    申请日:2021-10-27

    IPC分类号: H01L41/09 H01L41/187

    摘要: A vibrating plate-bonded body includes a supporting substrate composed of silicon, a vibrating plate composed of a highly rigid ceramics and having a thickness of 100 μm or smaller, and a bonding layer between the supporting substrate and vibrating plate, contacting a bonding surface of the vibrating plate and composed of α-Si. The arithmetic average roughness Ra of the bonding surface of the vibrating plate is 0.01 nm or more and 10.0 nm or less, and the pit density of the bonding surface of the vibrating plate is 10 counts or more per 100 μm2.