MULTILAYER CERAMIC ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20240242890A1

    公开(公告)日:2024-07-18

    申请号:US18619250

    申请日:2024-03-28

    Abstract: A multilayer ceramic capacitor includes a multilayer body, and first and second external electrodes on both ends of the multilayer body. A first end surface of the multilayer body includes first protruded portions partially protruding in one of length directions, from a corresponding one of first step layers, in a region including a corresponding one of dielectric layers being adjacent to at least one side, in the lamination directions, of the corresponding one of the first step layers, and a second end surface including second protruded portions each partially protruding in another one of the length directions, from a corresponding one of second step layers, in a region including another corresponding one of the dielectric layers being adjacent to at least one side, in the lamination directions, of the corresponding one of the second step layers.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF MULTILAYER CERAMIC ELECTRONIC COMPONENT

    公开(公告)号:US20250157744A1

    公开(公告)日:2025-05-15

    申请号:US19021403

    申请日:2025-01-15

    Abstract: In a multilayer ceramic electronic component, a first outer electrode includes a first base electrode layer, a first lower plating layer on the first base electrode layer, and a first upper plating layer on the first lower plating layer except for a first plating exposed region exposed on a surface of the first outer electrode so that the first lower plating layer includes the first plating exposed region, and a second outer electrode includes a second base electrode layer, a second lower plating layer on the second base electrode layer, and a second upper plating layer on the second lower plating layer except for a second plating exposed region exposed on a surface of the second outer electrode so that the second lower plating layer includes the second plating exposed region.

    MULTILAYER CERAMIC CAPACITOR
    3.
    发明公开

    公开(公告)号:US20240234033A1

    公开(公告)日:2024-07-11

    申请号:US18616240

    申请日:2024-03-26

    CPC classification number: H01G4/2325 H01G4/012 H01G4/30

    Abstract: A multilayer ceramic electronic component includes a multilayer body including first and second internal electrode layers alternately laminated with ceramic layers and exposed at one of first and second end surfaces, first step layers on a same plane as a respective one of the second internal electrode layers and exposed at the first end surface, and second step layers on a same plane as a respective one of the first internal electrode layers and exposed at the second end surface. Each of the first step layers and a corresponding one of the second internal electrode layers have a distance therebetween that increases closer to the first main surface than the second main surface, and each of the second step layers and a corresponding one of the first internal electrode layers have a distance therebetween that increases closer to the first main surface than the second main surface.

    MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR

    公开(公告)号:US20250062070A1

    公开(公告)日:2025-02-20

    申请号:US18937286

    申请日:2024-11-05

    Abstract: A multilayer ceramic capacitor include a multilayer body including internal electrode layers including first and second internal electrode layers facing each other and separated from each other, and a dielectric layer between the first and second internal electrode layers and including a ceramic material, and an outer electrode selectively connected to the first and second internal electrode layers. Each of the first and second internal electrode layers includes a rare earth oxide distributed along at least one of a pair of interfaces with the dielectric layer.

    MULTILAYER CERAMIC CAPACITOR
    5.
    发明公开

    公开(公告)号:US20240355543A1

    公开(公告)日:2024-10-24

    申请号:US18760093

    申请日:2024-07-01

    CPC classification number: H01G4/0085 H01G4/1227 H01G4/232 H01G4/252 H01G4/30

    Abstract: A multilayer ceramic capacitor includes a capacitor main portion including first, second, third, and fourth corner portions. The first insulating portion covers the first and second corner portions, and the second insulating portion covers the third and fourth corner portions. A roughness of the first corner portion is greater than a roughness of the first outer corner portion, a roughness of the second corner portion is greater than a roughness of the second outer corner portion, a roughness of the third corner portion is greater than a roughness of the third outer corner portion, and a roughness of the fourth corner portion is greater than a roughness of the fourth outer corner portion.

    MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE FOR MULTILAYER CERAMIC CAPACITOR

    公开(公告)号:US20240266109A1

    公开(公告)日:2024-08-08

    申请号:US18625326

    申请日:2024-04-03

    CPC classification number: H01G2/065 H01G4/30 H05K1/116 H05K2201/10378

    Abstract: A multilayer ceramic capacitor includes a capacitor body and an interposer. The capacitor body includes first and second external electrodes. The interposer includes an interposer body and first and second pillars. The interposer body includes an interposer-body first main surface adjacent to the capacitor body, an opposite interposer-body second main surface, and first and second through holes. The first and second pillars each include a metal with a melting point of about 230° C. or higher as a main component, provided in the respective first and second through holes, and conductively connected to the respective first and second external electrodes. The first and second pillars protrude from at least one of the interposer-body first and second main surfaces.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    7.
    发明公开

    公开(公告)号:US20240249885A1

    公开(公告)日:2024-07-25

    申请号:US18624446

    申请日:2024-04-02

    CPC classification number: H01G4/2325 H01G4/012 H01G4/1227 H01G4/1236 H01G4/30

    Abstract: A multilayer ceramic electronic component includes ceramic layers including Ca and Zr as main components, first and second external electrodes including a first base electrode layer and second base electrode layer, and a plated layer covering a portion of the first and second base electrode layers, the first and second base electrode layers include Cu as a main component, a multilayer body includes at an edge portion in a lamination direction a first compound region extending to a first end surface and a second compound region extending to the second end surface, the first compound region is joined with the first base electrode layer, the second compound region is joined with the second base electrode layer, and the first compound region and second compound region are not joined to each other.

    MULTILAYER CERAMIC CAPACITOR
    8.
    发明公开

    公开(公告)号:US20240234030A1

    公开(公告)日:2024-07-11

    申请号:US18618166

    申请日:2024-03-27

    CPC classification number: H01G2/12 H01G4/008 H01G4/12 H01G4/224 H01G4/30

    Abstract: A multilayer ceramic electronic component includes a multilayer body including first and second internal electrode layers each alternately laminated with ceramic layers and exposed at a respective end surface, first step layers on a same plane as a respective one of the second internal electrode layers and exposed at a first end surface, and second step layers on a same plane as a respective one of the first internal electrode layers and exposed at a second end surface. The first step layers each have a thickness in a height direction of the multilayer body greater at a location closer to the first main surface than the second main surface, and the second step layers each have a thickness in the height direction of the multilayer body greater at a location closer to the first main surface than the second main surface.

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