公开(公告)号：US20200343155A1

公开(公告)日：2020-10-29

申请号：US16961143

申请日：2019-01-09

Applicant: Mitsubishi Electric Corporation

Inventor： Hiroyuki KIYONAGA ,  Kenta FUJII ,  Tomohito FUKUDA ,  Shuji WAKAIKI ,  Takashi KUMAGAI ,  Hiroshi IKARASHI

IPC: H01L23/36 ,  H01L25/07 ,  H01L25/18 ,  H05K7/20 ,  H01L23/42 ,  H05K1/02 ,  H01L23/00

Abstract: A power conversion device that provides high heat dissipation and is easy to assemble. A power conversion device includes: a first heat dissipator; a second heat dissipator; a printed board having a first circuit pattern formed thereon; a first insulating member provided between first heat dissipator and printed board; a switching element including an electrode portion electrically bonded to first circuit pattern with a first bonding member interposed therebetween; a first fixing member bonded to an exposed surface of electrode portion; a heat dissipating member having one end bonded to first fixing member, and the other end provided between the switching element and second heat dissipator; a second insulating member sandwiched between second heat dissipator and switching element; and an installation portion.

公开(公告)号：US20230164958A1

公开(公告)日：2023-05-25

申请号：US17916854

申请日：2021-05-19

Applicant: Mitsubishi Electric Corporation

Inventor： Yuta YOSHIMI ,  Kenta FUJII ,  Yuji SHIRAKATA ,  Hiroyuki YAHARA ,  Hiroyuki KIYONAGA ,  Tomohito FUKUDA

IPC: H05K7/20 ,  H02M3/00 ,  H02M3/335 ,  H05K1/18

CPC classification number: H05K7/209 ,  H02M3/003 ,  H02M3/33569 ,  H05K1/181

Abstract: A power conversion device includes an electronic component, a first printed circuit board, a first cooling body, a second printed circuit board, a second cooling body, and a first wiring member. The power conversion device further includes a first insulating member. On a first main surface of the first printed circuit board, a first joint portion to which the first wiring member is joined is provided. Between a second main surface of the first printed circuit board and the first cooling body, the first insulating member is arranged on a rear surface of at least the first joint portion.

公开(公告)号：US20220215997A1

公开(公告)日：2022-07-07

申请号：US17608678

申请日：2020-05-20

Applicant: Mitsubishi Electric Corporation

Inventor： Hiroyuki KIYONAGA ,  Kenta FUJII ,  Yuji SHIRAKATA ,  Tomohito FUKUDA

IPC: H01F27/28 ,  H01F27/22

Abstract: A power conversion device includes an electronic component, a first printed board, a first cooling body, a second printed board, a second cooling body, a third printed board, and a third cooling body. The second cooling body extends from a second principal surface toward a first principal surface of the first printed board. The third cooling body extends from a second principal surface toward the first principal surface of the first printed board.

公开(公告)号：US20240195307A1

公开(公告)日：2024-06-13

申请号：US18554924

申请日：2022-05-02

Applicant: Mitsubishi Electric Corporation

Inventor： Mikito HIRATA ,  Kenta FUJII ,  Hiroyuki KIYONAGA ,  Yusuke MORIMOTO

IPC: H02M3/335 ,  H05K1/14 ,  H05K5/02 ,  H05K7/10 ,  H05K9/00

CPC classification number: H02M3/335 ,  H05K1/14 ,  H05K5/0247 ,  H05K7/1007 ,  H05K9/0024

Abstract: A power conversion device includes a casing, a first printed board, a second printed board, and a control circuit board. The casing has at least two inner surfaces. The first printed board is fixed to the inner surface of the casing. The second printed board is fixed to the inner surface of the casing, and disposed so as to intersect with the first printed board. The control circuit board is disposed along the second printed board. The control circuit board includes a circuit wiring and a shield pattern opposite to the circuit wiring in a layer different from the circuit wiring. When viewed from an opposite direction in which the shield pattern is opposite to the circuit wiring, the shield pattern at least partially overlaps the circuit wiring.

公开(公告)号：US20240177914A1

公开(公告)日：2024-05-30

申请号：US18553581

申请日：2022-05-19

Applicant: Mitsubishi Electric Corporation

Inventor： Hiroyuki KIYONAGA ,  Kenta FUJII ,  Takashi KUMAGAI ,  Tomohito FUKUDA ,  Koji NAKAJIMA

IPC: H01F27/22 ,  H01F27/28 ,  H02M3/00

CPC classification number: H01F27/22 ,  H01F27/2876 ,  H02M3/003

Abstract: A coil device includes a core having a loop-shaped magnetic path and a first winding part. The first winding part is wound around the core so as to pass through an inner region of the core surrounded by the core. In the inner region of the core and an outer region of the core, a metal base substrate in which a coil pattern is formed with an insulating layer interposed on a metal base body is disposed. A cooling body is thermally bonded to a side of the metal base body opposite to a side where the insulating layer and the coil pattern are formed. The first winding part includes the coil pattern.