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1.发明申请公开(公告)号：US20200277467A1
公开(公告)日：2020-09-03
申请号：US16647457
申请日：2018-09-07
发明人： Hiroaki YASUDA , Takehiro HAMAMURA , Takao ITO
摘要： An uncrosslinked rubber composition contains: a hydrogen-containing fluororubber; a thermal crosslinking agent that crosslinks the hydrogen-containing fluororubber when heated to a predetermined temperature; and a hydrogen site protective agent that bonds to carbon radicals resulting from breakage of carbon-hydrogen bonds of the hydrogen-containing fluororubber which occurs under irradiation.
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公开(公告)号：US20230174763A1
公开(公告)日：2023-06-08
申请号：US17920002
申请日：2021-04-08
发明人： Hiroaki YASUDA , Takao ITO , Ryohei TAKEDA , Takehiro HAMAMURA
CPC分类号： C08L27/16 , C08K3/36 , C08L83/04 , C09K3/1009 , F16J15/102 , C08L2312/00 , C09K2200/0247 , C09K2200/0637 , C09K2200/0672 , C09K2200/0685
摘要： To achieve properties such as a desirable compression fracture property, desirable compression set, and the like in the elastomer composition and the seal material using same. The elastomer composition of the present disclosure therefore includes an elastomer, phenol resin in powder form, and silica in powder form. The seal material of the present disclosure is obtained by crosslinking and molding the elastomer composition of the present disclosure. The seal material may be used in a semiconductor manufacturing device.
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公开(公告)号：US20230017563A1
公开(公告)日：2023-01-19
申请号：US17784638
申请日：2020-12-08
发明人： Hiroaki YASUDA , Takehiro HAMAMURA , Takao ITO
摘要： A seal material for a semiconductor manufacturing device is made of a rubber composition containing fluororubber and phenol resin powder. The content of the phenol resin powder is 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the fluororubber. The average particle size of the phenol resin powder is 1 μm or more and 20 μm or less.
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