公开(公告)号：US20100277932A1

公开(公告)日：2010-11-04

申请号：US12745974

申请日：2008-01-23

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Hsin-Tai Lin ,  Jing-Yi Chen

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Hsin-Tai Lin ,  Jing-Yi Chen

IPC分类号： F21V21/00

CPC分类号： H01L33/54 ,  H01L33/44 ,  H01L33/486 ,  H01L33/507 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A halation-free light-emitting diode holder includes a body and a retaining portion. The body has a die holder, which includes a first surface, a second surface, and an opened end. The retaining portion is provided on the second surface. By using the retaining portion, the optical gel in the die holder is blocked from capillary movement up along the second surface. Furthermore, having nano-material layers further formed on the second surface or having the area of the first surface made greater than the area of the opened-end also prevents the optical gel from climbing along the second surface. Thereby, a light halation circling a light pattern of the resultant light-emitting diode is avoided and the light-emitting diode is improved in luminance uniformity.

摘要翻译： 无卤发光二极管保持器包括主体和保持部分。 主体具有模具座，其包括第一表面，第二表面和开口端。 保持部设置在第二表面上。 通过使用保持部分，模具保持器中的光学凝胶被阻止毛细管沿着第二表面向上移动。 此外，具有进一步形成在第二表面上或具有大于开口端面积的第一表面的面积的纳米材料层也防止光学凝胶沿着第二表面爬升。 由此，避免了所产生的发光二极管的光图案的光晕，并且发光二极管的亮度均匀性得到改善。

公开(公告)号：US08269408B2

公开(公告)日：2012-09-18

申请号：US13003702

申请日：2008-08-12

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Jing-Yi Chen

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Jing-Yi Chen

IPC分类号： H01L33/62 ,  H01L33/36 ,  H01L33/00

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L2924/0002 ,  H05B33/0821 ,  H01L2924/00

摘要： An LED base structure with an embedded capacitor includes a body, at least one pair of metal layers, at least one dielectric layer, and at least two conductive channels. The body is an insulating base. The metal layers are disposed in the body, and the dielectric layer is disposed between the metal layers, so as to form an embedded capacitor. The conductive channels are electrically connected to the metal layers, respectively. The LED base structure is further electrically connected to a resistor for forming a resistor-capacitor delay circuit whereby a phase delay is effectuated whenever AC power is supplied to the LED base structure, so as to control the time for switching on one of two parallel-connected LEDs and, as a result, prevent the LEDs from flashing which might otherwise arise when the LEDs are supplied with AC power.

摘要翻译： 具有嵌入式电容器的LED基座结构包括主体，至少一对金属层，至少一个电介质层和至少两个导电沟道。 身体是绝缘基座。 金属层设置在主体中，并且电介质层设置在金属层之间，以便形成嵌入式电容器。 导电通道分别电连接到金属层。 LED基座结构进一步电连接到用于形成电阻器 - 电容器延迟电路的电阻器，由此每当向LED基座结构提供AC电力时，实现相位延迟，以便控制用于切换两个并联电路中的一个的时间， 连接的LED，从而防止LED闪烁，否则当LED被提供交流电源时可能会发生。

公开(公告)号：US20110121329A1

公开(公告)日：2011-05-26

申请号：US13003714

申请日：2008-08-06

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Jing-Yi Chen

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Jing-Yi Chen

IPC分类号： H01L27/15

CPC分类号： H01L25/0753 ,  H01L33/20 ,  H01L33/385 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： An AC LED structure includes an insulating substrate, an LED set, a first metal layer and a second metal layer. The LED set has a first light-emitting diode and a second light-emitting diode, which are deposited on the insulating substrate and insulated from each other. The first metal layer and the second metal layer commonly have a first profile and serve to electrically connect the first light-emitting diode and the second light-emitting diode in an inverse parallel connection. In virtue of the first metal layer and the second metal layer of the first profile deposited on the first light-emitting diode and the second light-emitting diode, the LED set is allowed to be connected in series or in parallel with another LED set according to practical needs, so as to be able to endure high current density or high voltage operation.

摘要翻译： AC LED结构包括绝缘基板，LED组，第一金属层和第二金属层。 LED组具有第一发光二极管和第二发光二极管，其沉积在绝缘基板上并彼此绝缘。 第一金属层和第二金属层通常具有第一轮廓并且用于以反并联方式电连接第一发光二极管和第二发光二极管。 通过沉积在第一发光二极管和第二发光二极管上的第一轮廓的第一金属层和第二金属层，允许LED组与另一个LED组串联或并联连接，根据 满足实际需要，以便能够承受高电流密度或高电压操作。

公开(公告)号：US20120018773A1

公开(公告)日：2012-01-26

申请号：US13258627

申请日：2009-04-07

申请人： Jing-Yi Chen ,  Shih-Yi Wen ,  Ching-Jen Pan ,  Ming-Hung Chen

发明人： Jing-Yi Chen ,  Shih-Yi Wen ,  Ching-Jen Pan ,  Ming-Hung Chen

IPC分类号： H01L33/64

CPC分类号： H05B33/0821 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05B33/0803 ,  H05B33/089 ,  Y02B20/341 ,  H01L2924/00014

摘要： The present invention relates to an alternating current (AC) light emitting diode (LED) structure with overload protection, which comprises an AC LED, a heat dissipating unit and an overload protecting unit. The AC LED is thermally connected with the heat dissipating unit, and the overload protecting unit is connected in series between the AC LED and a power source. Thus, when an overload current is inputted to the AC LED structure, the temperature of the overload protecting unit will rise to disconnect the AC LED from the power source. In this way, an open-circuit status can be produced timely in the AC LED structure to block the power input into the AC LED for purpose of protection against overload.

摘要翻译： 本发明涉及具有过载保护的交流（AC）发光二极管（LED）结构，其包括AC LED，散热单元和过载保护单元。 交流LED与散热单元热连接，过载保护单元串联连接在交流LED和电源之间。 因此，当过载电流被输入到AC LED结构时，过载保护单元的温度将升高以将AC LED与电源断开。 以这种方式，可以在AC LED结构中及时产生开路状态，以阻断AC LED的电力输入，以防止过载。

公开(公告)号：US20110121723A1

公开(公告)日：2011-05-26

申请号：US13003702

申请日：2008-08-12

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Jing-Yi Chen

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Jing-Yi Chen

IPC分类号： H01J1/62

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L2924/0002 ,  H05B33/0821 ,  H01L2924/00

摘要： An LED base structure with an embedded capacitor includes a body, at least one pair of metal layers, at least one dielectric layer, and at least two conductive channels. The body is an insulating base. The metal layers are disposed in the body, and the dielectric layer is disposed between the metal layers, so as to form an embedded capacitor. The conductive channels are electrically connected to the metal layers, respectively. The LED base structure is further electrically connected to a resistor for forming a resistor-capacitor delay circuit whereby a phase delay is effectuated whenever AC power is supplied to the LED base structure, so as to control the time for switching on one of two parallel-connected LEDs and, as a result, prevent the LEDs from flashing which might otherwise arise when the LEDs are supplied with AC power.

摘要翻译： 具有嵌入式电容器的LED基座结构包括主体，至少一对金属层，至少一个电介质层和至少两个导电沟道。 身体是绝缘基座。 金属层设置在主体中，并且电介质层设置在金属层之间，以便形成嵌入式电容器。 导电通道分别电连接到金属层。 LED基座结构进一步电连接到用于形成电阻器 - 电容器延迟电路的电阻器，由此每当向LED基座结构提供AC电力时，实现相位延迟，以便控制用于切换两个并联 - 连接的LED，从而防止LED闪烁，否则当LED被提供交流电源时可能会发生。

公开(公告)号：US20110044035A1

公开(公告)日：2011-02-24

申请号：US12937784

申请日：2008-04-16

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Hsin-Tai Lin ,  Jing-Yi Chen

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Hsin-Tai Lin ,  Jing-Yi Chen

IPC分类号： F21V33/00 ,  H02M7/06

CPC分类号： H02M7/08 ,  H02M7/10

摘要： A parallel bridge circuit structure and a high-voltage parallel bridge circuit structure are disclosed. The parallel bridge circuit structure includes a first bridge circuit and a second bridge circuit. The first bridge circuit includes a plurality of first diodes, and the second bridge circuit includes a plurality of second diodes. Each of the second diodes is exclusively connected to one of the first diodes in parallel. With the design of the parallel connection between the first bridge circuit and the second bridge circuit, break of the entire circuit caused by a damaged diode is prevented. Moreover, with the aid of the AC signal phase delay circuit structure, the output voltage of the parallel bridge circuit structure can be stable and continuous voltage, while the high-voltage parallel bridge circuit structure includes a plurality of parallel bridge circuit structures so as to endure a high voltage input.

摘要翻译： 公开了并联桥式电路结构和高压并联桥式电路结构。 并联电路电路结构包括第一桥接电路和第二桥接电路。 第一桥接电路包括多个第一二极管，第二桥接电路包括多个第二二极管。 每个第二二极管并联地独立地连接到第一二极管之一。 通过设计第一桥接电路和第二桥接电路之间的并联连接，可以防止由损坏的二极管引起的整个电路的断开。 此外，借助于交流信号相位延迟电路结构，并联桥式电路结构的输出电压可以稳定和连续的电压，而高压并联桥电路结构包括多个并联桥电路结构，以便 忍受高电压输入。

公开(公告)号：US07910395B2

公开(公告)日：2011-03-22

申请号：US12441204

申请日：2006-09-13

申请人： Shih-Chang Shei ,  Ming-Hung Chen ,  Shih-Yi Wen ,  Chun-Che Lee

发明人： Shih-Chang Shei ,  Ming-Hung Chen ,  Shih-Yi Wen ,  Chun-Che Lee

IPC分类号： H01L21/00

CPC分类号： H01L27/156 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment.

摘要翻译： LED结构包括第一基板; 形成在所述第一基板上的粘附层; 形成在粘附层上的第一欧姆接触层; 形成在第一欧姆接触层上的外延层; 覆盖其暴露表面的第一欧姆接触层和外延层的第一隔离层; 以及第一导电板和第二导电板，两者分别形成在第一隔离层中并电连接到第一欧姆接触层和外延层。 沟槽允许LED结构促进复杂的串联/并联连接，以便在高压环境下以单结构的形式实现LED结构的简单和多种应用。

公开(公告)号：US20100059733A1

公开(公告)日：2010-03-11

申请号：US12441204

申请日：2006-09-13

申请人： Shih-Chang Shei ,  Ming-Hung Chen ,  Shih-Yi Wen ,  Chun-Che Lee

发明人： Shih-Chang Shei ,  Ming-Hung Chen ,  Shih-Yi Wen ,  Chun-Che Lee

IPC分类号： H01L33/00

CPC分类号： H01L27/156 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The first trenches or the second trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment.

摘要翻译： LED结构包括第一基板; 形成在所述第一基板上的粘附层; 形成在粘附层上的第一欧姆接触层; 形成在第一欧姆接触层上的外延层; 覆盖其暴露表面的第一欧姆接触层和外延层的第一隔离层; 以及第一导电板和第二导电板，两者分别形成在第一隔离层中并电连接到第一欧姆接触层和外延层。 第一沟槽或第二沟槽允许LED结构促进复杂的串联/并联连接，以便在高压环境下以单结构的形式实现LED结构的简单和多种应用。

公开(公告)号：US20060138436A1

公开(公告)日：2006-06-29

申请号：US11147185

申请日：2005-06-08

申请人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

发明人： Ming-Hung Chen ,  Shih-Yi Wen ,  Wu-Cheng Kuo ,  Bing-Ru Chen ,  Jui-Ping Weng ,  Hsiao-Wen Lee

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.

公开(公告)号：US06995368B2

公开(公告)日：2006-02-07

申请号：US10795407

申请日：2004-03-09

申请人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Ming-Hung Chen

发明人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Ming-Hung Chen

IPC分类号： G21K7/00

CPC分类号： G01Q10/045 ,  G01Q70/10 ,  Y10S977/872

摘要： A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.

摘要翻译： MEMS差分致动纳米探针包括平行布置的四个悬架梁，连接到悬架梁的连接底座，纳米探针。 悬挂梁中的两个由于热膨胀而伸长以允许探针的偏转。 通过将悬架梁加热到不同位置，MEMS微分致动纳米探针可以在两个方向上以两个自由度移动。 MEMS差分致动纳米探针的偏转也可以以压电或静电方式实现。