HEAT SINK BACK PLATE MODULE
    1.
    发明申请
    HEAT SINK BACK PLATE MODULE 审中-公开
    散热背板模块

    公开(公告)号:US20080002366A1

    公开(公告)日:2008-01-03

    申请号:US11748120

    申请日:2007-05-14

    IPC分类号: H05K7/20

    摘要: A heat sink back plate module suitable for fixing a heat sink on a heat source disposed on a motherboard is provided. A plurality of positioning holes is disposed around the heat source. The heat sink back plate module includes a plate body and a plurality of guideposts. The plate body having a plurality of locking holes is disposed under the motherboard. An internal thread is disposed in each locking hole. A portion of the locking holes are aligned to the positioning holes on the motherboard. The guideposts are assembled in the locking holes corresponding to the positioning holes. Each of the guideposts has an external thread disposed at one end. The external thread of the guidepost is locked in the internal thread of the locking hole corresponding to the positioning holes.

    摘要翻译: 提供了一种适于将散热器固定在设置在母板上的热源上的散热器背板模块。 多个定位孔设置在热源周围。 散热器背板模块包括板体和多个路标。 具有多个锁定孔的板体设置在母板的下方。 内螺纹设置在每个锁定孔中。 锁定孔的一部分与母板上的定位孔对准。 路标组装在与定位孔对应的锁定孔中。 每个路标都有一个设在一端的外螺纹。 导轨的外螺纹锁定在与定位孔对应的锁定孔的内螺纹中。

    FAN MODULE
    2.
    发明申请
    FAN MODULE 审中-公开
    风扇模块

    公开(公告)号:US20080137297A1

    公开(公告)日:2008-06-12

    申请号:US11942431

    申请日:2007-11-19

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20172

    摘要: A fan module including a fan and a light source set is provided. The fan includes a frame and a blade set. The frame has a accommodating space, an air inlet and an air outlet, and the air inlet and the air outlet are communicated with each other. The blade set is provided at the accommodating space. The light source set is provided at the frame as an independent module and has a circuit board and a plurality of light-emitting elements provided at the circuit board. Another fan module including a blade set base, a light source set, and a support is provided, wherein the light source set is provided at the blade set base. The light source set includes a circuit board and at least one light-emitting elements provided at the circuit board, and the circuit board is disposed between the blade set base and the support.

    摘要翻译: 提供了包括风扇和光源组的风扇模块。 风扇包括一个框架和一个叶片组。 框架具有容纳空间,空气入口和空气出口,空气入口和空气出口彼此连通。 叶片组设置在容纳空间处。 光源组作为独立模块设置在框架上,并具有设置在电路板上的电路板和多个发光元件。 提供了另一个风扇模块,其中包括一个叶片组底座,一个光源组和一个支架,其中光源组设置在叶片组底座。 光源组包括电路板和设置在电路板上的至少一个发光元件,并且电路板设置在刀片组基座和支撑件之间。

    HEAT DISSIPATION MODULE
    3.
    发明申请
    HEAT DISSIPATION MODULE 审中-公开
    散热模块

    公开(公告)号:US20080006399A1

    公开(公告)日:2008-01-10

    申请号:US11754373

    申请日:2007-05-29

    IPC分类号: F28F3/00

    摘要: A heat dissipation module including a heat sink, a thermal medium, and a thermal medium cap is provided. The heat sink is suitable to be disposed on a heat source, and the heat sink has a plurality of grooves. The thermal medium is disposed on a surface of the heat sink contacting the heat source. In addition, the thermal medium cap has a cover and a plurality of fixing portions extending from the cover. The thermal medium is covered by the cover, and the fixing portions penetrate the grooves.

    摘要翻译: 提供了包括散热器,热介质和热介质盖的散热模块。 散热器适合于放置在热源上,并且散热器具有多个凹槽。 热介质设置在与热源接触的散热器的表面上。 此外,热介质盖具有盖和从盖延伸的多个固定部。 热介质被盖覆盖,固定部分穿透凹槽。

    BAG OF NOTEBOOK COMPUTER
    5.
    发明申请
    BAG OF NOTEBOOK COMPUTER 审中-公开
    笔记本电脑包

    公开(公告)号:US20100276316A1

    公开(公告)日:2010-11-04

    申请号:US12768747

    申请日:2010-04-28

    IPC分类号: B65D85/00 A45C13/00

    摘要: A bag of a notebook computer for containing the notebook computer is provided. The bag includes an upper cover, a lower cover, and a carrying handle. The lower cover is pivotally connected with the upper cover. The upper cover is capable of being closed to the lower cover to form a containing space for containing the notebook computer, and it is capable of being opened from the lower cover to expose the notebook computer. The carrying handle is connected with the upper cover and the lower cover, respectively, and it is disposed across a connecting place of the upper cover and the lower cover. When the lower cover is disposed at a supporting surface and the upper cover is opened, the carrying handle lifts the lower cover so that an angle is formed between the lower cover and the supporting surface.

    摘要翻译: 提供一包用于容纳笔记本电脑的笔记本电脑。 该袋包括上盖,下盖和携带手柄。 下盖与上盖枢转连接。 上盖能够封闭到下盖以形成用于容纳笔记本电脑的容纳空间,并且能够从下盖打开以暴露笔记本计算机。 手提带分别与上盖和下盖相连,并且设置在上盖和下盖的连接处。 当下盖设置在支撑表面并且上盖打开时,承载手柄提升下盖,使得下盖和支撑表面之间形成一角度。

    Thermal module with heat pipe
    6.
    发明申请
    Thermal module with heat pipe 审中-公开
    散热模块带热管

    公开(公告)号:US20070285897A1

    公开(公告)日:2007-12-13

    申请号:US11709125

    申请日:2007-02-22

    IPC分类号: H05K7/20

    摘要: A thermal module with heat pipe is disclosed to include a heat-dissipation plate, which has an accommodation groove that accommodates a heat pipe that is bonded to the accommodation groove with a bonding glue, and at least one retaining groove formed in the accommodation groove for retaining the bonding glue to prevent overflow of the bonding glue during its fluid state so as to improve the yield rate of the fabrication of the thermal module with heat pipe, avoid a further follow-up process, facilitate the quality control, save the cost, and keep a good looking of the finished product.

    摘要翻译: 公开了一种具有热管的热模块,包括散热板,该散热板具有容纳用接合胶结合到容纳槽的热管的容纳槽,以及形成在容纳槽中的至少一个保持槽 保持粘合胶以防止胶粘剂在其流体状态下溢出,从而提高热模块制热的成品率,避免进一步的后续处理,便于质量控制,节省成本, 并保持好看的成品。