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公开(公告)号:US20230036241A1
公开(公告)日:2023-02-02
申请号:US17390493
申请日:2021-07-30
发明人: Stanislav Gudkov , Aleksei Dubov , Evgeniy Ostanin
IPC分类号: B29C64/106 , G01L5/1627
摘要: Systems and methods for monitoring stress in 3D-printed building structures using embedded and surface sensors. The sensors may be embedded during or after the 3D printing process. The sensors may be strain gauges integrally formed in the 3D-printed building structure or positioned on the surface of the 3D-printed building structure. The embedded and surface sensors may measure tensile and compressive deformation occurring during the printing process, material relaxation process, the transportation process, and at a final location of the 3D-printed building structure. Deformation data collected by the sensors may be compared to accepted threshold values based on the material of the 3D-printed building structure.
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公开(公告)号:US11654611B2
公开(公告)日:2023-05-23
申请号:US17390493
申请日:2021-07-30
发明人: Stanislav Gudkov , Aleksei Dubov , Evgeniy Ostanin
IPC分类号: B29C64/106 , G01L5/1627 , B33Y30/00 , B33Y10/00
CPC分类号: B29C64/106 , G01L5/1627 , B33Y10/00 , B33Y30/00
摘要: Systems and methods for monitoring stress in 3D-printed building structures using embedded and surface sensors. The sensors may be embedded during or after the 3D printing process. The sensors may be strain gauges integrally formed in the 3D-printed building structure or positioned on the surface of the 3D-printed building structure. The embedded and surface sensors may measure tensile and compressive deformation occurring during the printing process, material relaxation process, the transportation process, and at a final location of the 3D-printed building structure. Deformation data collected by the sensors may be compared to accepted threshold values based on the material of the 3D-printed building structure.
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