公开(公告)号：US20190075651A1

公开(公告)日：2019-03-07

申请号：US15696995

申请日：2017-09-06

Applicant: Microsoft Technology Licensing, LLC

Inventor： Jonathan Bernard LESTER ,  Bhret Robert GRAYDON ,  Matthew David MICKELSON ,  Lauren Akemi Hamamoto Donegan RYAN

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/0216 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/09781

Abstract: A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film having a tensile strength greater than the first and second copper layers and greater than the dielectric layer.