摘要:
A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.
摘要:
The screen printing mask is used for printing paste simultaneously on circuit boards held by the carrier. The mask has a flat mask plate. On the lower surface of the mask plate, a flat-bottomed recess capable to accommodating at least one of the circuit boards is formed so as to correspond to the array of the circuit boards on the carrier. A pattern hole is formed only in the recess.
摘要:
A component mounting method includes: identifying, by image processing, a dark color region from image data obtained by imaging a two-dimensional region including a pickup face of a component to be picked up; deriving position data indicating a position of the identified dark color region; and deriving, based on the derived position data, a pickup position indicating a position at which a nozzle picks up the component. The imaging is performed by an imaging unit, and the dark color region indicates a dark color portion between electrodes of the component.
摘要:
A method of determining a solder paste height of solder paste printed on a circuit board, the method including obtaining a two-dimensional image of the circuit board which is captured from above a solder printed surface, and determining the solder paste height corresponding to a pixel value of each of pixels of the two-dimensional image, based on height information which defines a relationship between the pixel value and the solder paste height, the pixel value being a value representing at least one of luminance of red in a RGB color model, luminance of green in the RGB color model, luminance of blue in the RGB color model, hue in a HSI color model, saturation in the HSI color model, and intensity in the HSI color model.
摘要:
A method of determining a solder paste height of solder paste printed on a circuit board, the method including obtaining a two-dimensional image of the circuit board which is captured from above a solder printed surface, and determining the solder paste height corresponding to a pixel value of each of pixels of the two-dimensional image, based on height information which defines a relationship between the pixel value and the solder paste height, the pixel value being a value representing at least one of luminance of red in a RGB color model, luminance of green in the RGB color model, luminance of blue in the RGB color model, hue in a HSI color model, saturation in the HSI color model, and intensity in the HSI color model.
摘要:
To provide a tape feeder capable of reducing absorption dislocation, a tape feeder according to the present invention is a feeder feeding a carrier tape including a plurality of component storage units of a rectangular shape provided at predetermined intervals in a feed direction. The tape feeder includes a first magnet which is provided below a bottom surface of the component storage unit fed to a feed region so as to extend in the feed direction below one side of the bottom surface of the component storage unit in a width direction, and which attracts a component of the component storage unit fed to the feed region to one side of the bottom surface of the component storage unit in the width direction.
摘要:
A mounting-line power control device (100) includes: a target value obtaining unit (110) which obtains, for each mounting line, a target value for demand power for a first period; a priority obtaining unit (120) which obtains a first priority level of each mounting line; a target value changing unit (130) which decreases the target value for the demand power of a second mounting line in the first period when the demand power of a first mounting line in the first period exceeds its target value, the second mounting line having the lower first priority level than the first mounting line; and a power usage changing unit (140) which reduces power used in the first period by the component-mounted board production apparatus included in the second mounting line, such that the demand power of the second mounting line in the first period does not exceed the decreased target value.
摘要:
A mounting-line power control device (100) includes: a target value obtaining unit (110) which obtains, for each mounting line, a target value for demand power for a first period; a priority obtaining unit (120) which obtains a first priority level of each mounting line; a target value changing unit (130) which decreases the target value for the demand power of a second mounting line in the first period when the demand power of a first mounting line in the first period exceeds its target value, the second mounting line having the lower first priority level than the first mounting line; and a power usage changing unit (140) which reduces power used in the first period by the component-mounted board production apparatus included in the second mounting line, such that the demand power of the second mounting line in the first period does not exceed the decreased target value.
摘要:
Heating characteristic value at any measuring point of an object at any measuring location of an heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, temperature profile of the object heated under modified heating condition may be simulated in a short period of time without actually heating and measuring temperature of the object at high accuracy level. By using such simulation, appropriate heating condition for heating an object in accordance with desired heating condition may easily be determined.
摘要:
The present invention relates to a nozzle suitable for jetting high pressure and high temperature steam, and a method and an apparatus for producing an entangled nonwoven fabric using the nozzle. According to the apparatus, a steam inlet side main conduit and a steam outlet side conduit are connected with both end parts of a tubular nozzle holder in a longitudinal direction provided integrally with nozzle members having a plurality of nozzle holes. A steam outlet side conduit is provided with an opening/closing valve and a trap conduit is branched from a conduit at an upstream side from the opening/closing valve. By opening the opening/closing valve, a rapid temperature rise of the nozzle holder can be enabled at a time of starting a production of a nonwoven fabric. Furthermore, even in the opening/closing valve is closed in a regular operation, drainage generated inside the nozzle holder can always be discharged to outside so that steam can be jetted stably and continuously, and thus a high quality entangled fiber nonwoven fabric can be produced continuously from the fiber web by the steam.