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公开(公告)号：US20230030748A1
公开(公告)日：2023-02-02
申请号：US17390288
申请日：2021-07-30
发明人： Michael Pope , Cameron Peter Jue , Rajat Mittal , Ryan Fleming , Boyd Drew Allin
摘要： A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.
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公开(公告)号：US20230408829A1
公开(公告)日：2023-12-21
申请号：US18242990
申请日：2023-09-06
发明人： Michael Pope , Cameron Peter Jue , Rajat Mittal , Ryan Fleming , Boyd Drew Allin
CPC分类号： G02B27/0176 , G06F1/203 , G06F1/206 , H05K7/20963
摘要： A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.
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公开(公告)号：US12127430B2
公开(公告)日：2024-10-22
申请号：US17589872
申请日：2022-01-31
发明人： Giti Karimi Moghaddam , Douglas Moskowitz , Kyung Won Park , Ryan Fleming , Alexander Klement , Donghee Nam , Yi-Chen Kuo , Mark Shintaro Ando
CPC分类号： H10K50/87 , H01L25/18 , H05K1/0204 , H05K1/189 , H05K7/20972 , H05K7/2099 , H05K2201/056 , H05K2201/10128 , H05K2201/10159 , H05K2201/2036
摘要： A device includes a micro-organic light emitting diode (μ-OLED) display panel and an electronic component. An electrical connector electrically couples the μ-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the μ-OLED display panel. The standoff physically couples the electronic component and the μ-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the μ-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the μ-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.
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公开(公告)号：US12093094B1
公开(公告)日：2024-09-17
申请号：US17681611
申请日：2022-02-25
发明人： Christopher Jon Kappler , Ryan Fleming , Ray C. He
CPC分类号： G06F1/206 , G06F1/203 , G06F1/28 , H02J7/0063
摘要： The disclosed computer-implemented method may include detecting an amount of energy being discharged from a battery of a computing device. The method may further include predicting, based on the amount of energy being discharged from the battery, a thermal response of the computing device. Furthermore, the method may include performing thermal management of the computing device based on the predicted thermal response. Various other methods, systems, and computer-readable media are also disclosed.
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公开(公告)号：US20230354566A1
公开(公告)日：2023-11-02
申请号：US18167052
申请日：2023-02-09
发明人： Arman Boromand , Giti Karimi Moghaddam , Ryan Fleming , Michael Nikkhoo , Alex Ockfen , Sheng Ye , Andrew John Ouderkirk , Hongtao Guo
CPC分类号： H05K7/20963 , B32B7/12 , B32B27/32 , B32B27/08 , B32B7/035 , B32B2551/00 , B32B2250/242 , B32B2307/414 , B32B2307/302 , B32B2307/54 , B32B2307/732 , B32B2307/204 , B32B2307/206 , B32B2307/516 , B32B2307/518
摘要： A polymer laminate includes a plurality of ultra-high molecular weight polyethylene thin films, where each polyethylene thin film has an in-plane thermal conductivity of at least approximately 5 W/mK and an in-plane elastic modulus of at least approximately 20 GPa. The polymer laminate may be incorporated into an eyewear device and may be configured to disperse heat during operation thereof in a manner effective to improve the functionality and/or wearability of the device.
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公开(公告)号：US11782281B2
公开(公告)日：2023-10-10
申请号：US17390288
申请日：2021-07-30
发明人： Michael Pope , Cameron Peter Jue , Rajat Mittal , Ryan Fleming , Boyd Drew Allin
CPC分类号： G02B27/0176 , G06F1/203 , G06F1/206 , H05K7/20963
摘要： A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.
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