Microphone structure
    1.
    发明授权

    公开(公告)号:US11223908B1

    公开(公告)日:2022-01-11

    申请号:US17013838

    申请日:2020-09-07

    IPC分类号: H04R19/04

    摘要: A microphone structure includes a backplate, a diaphragm, a sidewall and at least one airflow retaining wall. The backplate has a plurality of through holes. The diaphragm has at least one slot. The sidewall is located between the backplate and the diaphragm such that the sidewall, the diaphragm and the backplate collectively define a chamber. The at least one airflow retaining wall protrudes from the backplate and is located within the chamber. The airflow retaining wall is positioned between the through holes and the slot, and has an uneven width.

    ACOUSTIC TRANSDUCER
    2.
    发明申请
    ACOUSTIC TRANSDUCER 审中-公开

    公开(公告)号:US20200322731A1

    公开(公告)日:2020-10-08

    申请号:US16909973

    申请日:2020-06-23

    IPC分类号: H04R19/00 H04R7/06

    摘要: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions and a plurality of elastic structures. The elastic structures are concentrically arranged along peripheries of the vibratile portions. The acoustic transducer further has a connecting portion extending from the back plate to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The elastic structures include a first elastic structure and a second elastic structures arranged alongside of the boundary, and a third elastic structure arranged along an outer periphery of the vibrating membrane. The vibratile portions are geometrically different from each other and different in rigidity, and the vibratile portions can vibrate independently to respond to various sound pressure levels.

    ACOUSTIC TRANSDUCER
    3.
    发明申请
    ACOUSTIC TRANSDUCER 审中-公开

    公开(公告)号:US20170257708A1

    公开(公告)日:2017-09-07

    申请号:US15604670

    申请日:2017-05-25

    IPC分类号: G01J3/50

    CPC分类号: H04R19/005 H04R7/06 H04R19/04

    摘要: An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions. The acoustic transducer further has a connecting portion that is connected to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The vibratile portions are geometrically different. Thereby, the vibratile portions can vibrate independently. This allows a designer to easily enhance the dynamic range of the acoustic transducer by geometrically modifying the vibrating membrane without increasing the total area of the vibrating membrane while maintaining a certain good degree of sensitivity and signal-to-noise ratio.

    MEMS chip package
    4.
    发明授权

    公开(公告)号:US09656853B2

    公开(公告)日:2017-05-23

    申请号:US14940167

    申请日:2015-11-13

    IPC分类号: B81B3/00

    摘要: A micro-electro-mechanical system (MEMS) chip package including a circuit substrate, a driving chip and a MEMS sensor is provided. The circuit substrate has a first surface and a second surface opposite thereto. The driving chip is embedded within the circuit substrate and includes a first signal transmission electrode, a second signal transmission electrode and a third signal transmission electrode. The MEMS sensor is disposed on the first surface of the circuit substrate. The circuit substrate includes at least one first conductive wiring electrically connected with the first signal transmission electrode and at least one second conductive wiring electrically connected with the second signal transmission electrode. The first conductive wiring is merely exposed at the first surface and the second conductive wiring is merely exposed at the second surface. The MEMS sensor is electrically connected with the first signal transmission electrode through the first conductive wiring.

    Speaker
    6.
    发明授权
    Speaker 有权

    公开(公告)号:US10972840B2

    公开(公告)日:2021-04-06

    申请号:US16452546

    申请日:2019-06-26

    摘要: A speaker includes a circuit board, a peripheral wall, a diaphragm, at least one support member and at least one piezoelectric actuator. The peripheral wall is located on a surface of the circuit board. The diaphragm has an outer boundary attached to the peripheral wall. The diaphragm, the peripheral wall and the circuit board collectively form a chamber. The at least one support member protrudes from the surface of the circuit board and is located within the chamber. The at least one piezoelectric actuator is located on a top of the at least one support member and electrically driven to cause a vibration of the diaphragm under applied electrical bias.

    MEMS sensor
    7.
    发明授权

    公开(公告)号:US10710868B2

    公开(公告)日:2020-07-14

    申请号:US16262927

    申请日:2019-01-31

    摘要: A MEMS sensor including an electrode plate, a diaphragm structure, a support structure, and a pressure relief film. The electrode plate has a conductive portion. The diaphragm structure is disposed at a side of the electrode plate with an interval, and has a sensing film. The support structure is disposed between the diaphragm structure and the electrode plate, and surrounds an electrical coupling zone and a gas flow zone. The support structure includes an inner wall and an outer wall. An outer edge of the gas flow zone is surrounded by the inner wall. An outer edge of the electrical coupling zone is surrounded by the outer wall. The pressure relief film covers the gas flow zone.

    PIEZOELECTRIC TRANSDUCER
    8.
    发明申请

    公开(公告)号:US20190222940A1

    公开(公告)日:2019-07-18

    申请号:US15913938

    申请日:2018-03-07

    摘要: A piezoelectric transducer including a substrate, a piezoelectric layer and a stiffening structure is provided. The substrate has a chamber. The piezoelectric layer has a displacement zone, a plurality of sensing zones, a plurality of gaps, a plurality of top electrodes, and a plurality of bottom electrodes. The displacement zone is located over the chamber. The sensing zones are surroundingly connected to an outer edge of the displacement zone and are located over the chamber. The gaps are each formed between any adjacent two of the plurality of sensing zones, and each of the gaps communicates with the chamber. The top electrodes are each disposed on a top surface of each of the sensing zones. The bottom electrodes are each disposed on a bottom surface of each of the sensing zones. The stiffening structure is disposed on a bottom of the displacement zone.

    Vibration sensing assembly for bone conduction microphone

    公开(公告)号:US11561129B2

    公开(公告)日:2023-01-24

    申请号:US17381207

    申请日:2021-07-21

    IPC分类号: G01H11/06 H04R1/04 H04R19/04

    摘要: A vibration sensing assembly, including a base, a side shell, a sensor, an upper cover, and a diaphragm assembly, is provided. The base includes first and second bottom plates. A first cavity is formed between the first and second bottom plates. The second bottom plate includes first and second through holes. The side shell is disposed on the second bottom plate and includes a cylinder and an inner partition. The inner partition divides the cylinder into a second cavity and an airflow channel. The airflow channel is communicated with the first cavity through the first through hole. The sensor is disposed in the second cavity and covers the second through hole. The side shell is located between the base and the upper cover. The base, the side shell, and the upper cover jointly form an outer shell. The diaphragm assembly is disposed between the side shell and the upper cover.

    MICRO-ELECTRO MECHANICAL DEVICE
    10.
    发明申请

    公开(公告)号:US20220408197A1

    公开(公告)日:2022-12-22

    申请号:US17738025

    申请日:2022-05-06

    摘要: A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.