公开(公告)号：US20240248455A1

公开(公告)日：2024-07-25

申请号：US18100296

申请日：2023-01-23

Applicant: Mellanox Technologies, Ltd.

Inventor： Tahir Cader ,  Siddha Ganju ,  Avraham Ganor ,  Ran Hasson Ruso ,  Elad Mentovich

IPC: G05B19/4155

CPC classification number: G05B19/4155 ,  G05B2219/49216

Abstract: Methods, apparatuses, and computer program products for proactive thermal management and processing core selection are provided. An example method includes receiving a job packet that is associated with a packet profile and determining one or more performance parameters associated with a performance of the job packet as defined by the packet profile. The method further includes generating a proactive thermal management procedure based upon the one or more performance parameters and associating the proactive thermal management procedure with the job packet. The method may further include determining a selected processing core from amongst a plurality of processing cores for the performance of the job packet based upon one or more operating characteristics of the processing cores and/or one or more performance parameters of the job packet.

公开(公告)号：US20240130069A1

公开(公告)日：2024-04-18

申请号：US17968447

申请日：2022-10-18

Applicant: Mellanox Technologies, Ltd.

Inventor： Ran Hasson Ruso ,  Tahir Cader ,  Elad Mentovich ,  Susheela Narasimhan

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20136 ,  G06F1/206

Abstract: Devices, apparatuses, systems, and methods are provided for improved thermal management in networking computing devices. An example thermal management apparatus includes a housing defining a first end and a second end opposite the first end. The apparatus further includes an electronic component supported within the housing, such as a GPU. The apparatus includes a primary inlet that receives a primary airflow having a first temperature and a secondary inlet that receives a secondary airflow having a second temperature where the second temperature is different than the first temperature. The primary airflow and the secondary airflow are collectively configured to dissipate heat generated by the electronic component.

公开(公告)号：US20240306287A1

公开(公告)日：2024-09-12

申请号：US18118958

申请日：2023-03-08

Applicant: Mellanox Technologies, Ltd.

Inventor： Tahir Cader ,  David Paul Mohr ,  Boaz Atias ,  Elad Mentovich

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H05K2201/066

Abstract: Assemblies, systems, and methods are provided for dissipating heat from a PCB assembly. The PCB assembly may include a PCB comprising a first thermally conductive structure. A first heat generating component may be connected to the PCB and may be vertically disposed with respect to the PCB. The PCB may be disposed on a first side of the first heat generating component. The first thermally conductive structure may be configured to conduct heat laterally and cross-sectionally through the first thermally conductive structure toward a heat sink. A second thermally conductive structure may be disposed on a second side of the first heat generating component. The second thermally conductive structure may be configured to conduct heat laterally and cross-sectionally through the second thermally conductive structure into a heat sink. A heat sink configured to dissipate heat may be disposed between the first thermally conductive structure and the second thermally conductive structure.