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公开(公告)号:US09158880B2
公开(公告)日:2015-10-13
申请号:US14043197
申请日:2013-10-01
Applicant: MediaTek Inc.
Inventor: Fu-Kang Pan , Nan-Cheng Chen , Shih-Chieh Lin , Hui-Chi Tang , Ying Liu , Yang Liu
IPC: G06F17/50
CPC classification number: G06F17/5072 , G06F17/5068 , G06F17/5077 , G06F2217/12 , G06F2217/38 , G06F2217/40
Abstract: A layout method for a printed circuit board (PCB) is provided. A memory type of a dynamic random access memory (DRAM) to be mounted on the PCB is obtained. A module group is obtained from a database according to the memory type of the DRAM, wherein the module group includes a plurality of routing modules. A plurality of PCB parameters are obtained. A specific routing module is selected from the module group according to the PCB parameters. The specific routing module is implemented into a layout design of the PCB. The specific routing module includes layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.
Abstract translation: 提供了印刷电路板(PCB)的布局方法。 获得要安装在PCB上的动态随机存取存储器(DRAM)的存储器类型。 根据DRAM的存储器类型从数据库获得模块组,其中模块组包括多个路由模块。 获得多个PCB参数。 根据PCB参数从模块组中选择一个特定的路由模块。 具体的路由模块被实现为PCB的布局设计。 特定路由模块包括关于主芯片,存储芯片以及主芯片和存储芯片之间的路由配置的布局信息。
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公开(公告)号:US09846756B2
公开(公告)日:2017-12-19
申请号:US14843113
申请日:2015-09-02
Applicant: MediaTek Inc
Inventor: Fu-Kang Pan , Nan-Cheng Chen , Shih-Chieh Lin , Hui-Chi Tang , Ying Liu , Yang Liu , Ching-Chih Li
IPC: G06F17/50
CPC classification number: G06F17/5072 , G06F17/5068 , G06F17/5077 , G06F2217/12 , G06F2217/38 , G06F2217/40
Abstract: A layout method for a printed circuit board (PCB) is provided. The method obtains a memory type of a dynamic random access memory (DRAM) to be mounted on the PCB, obtains a module group from a database according to the memory type of the DRAM, wherein the module group comprises a plurality of routing modules, obtains a plurality of PCB parameters, selects a specific routing module from the module group according to the PCB parameters, and implements the specific routing module into a layout design for PCB fabrication. The specific routing module comprises layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.
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