公开(公告)号：US12095494B1

公开(公告)日：2024-09-17

申请号：US17885554

申请日：2022-08-11

Applicant: Marvell Asia Pte Ltd

Inventor： Aatreya Chakravarti ,  Wolfgang Sauter ,  Mark William Kuemerle ,  Eric William Tremble

IPC: H04K1/10 ,  H01L23/538 ,  H01L23/66 ,  H04B1/40 ,  H04L27/28

CPC classification number: H04B1/40 ,  H01L23/5384 ,  H01L23/66 ,  H01L2223/6616

Abstract: An electronic network device includes: (i) an integrated circuit (IC) die configured to exchange signals between the electronic network device and one or more other devices that are remote from the electronic network device, (ii) a plurality of transceiver dies, separate from the IC die, the plurality of transceiver dies being disposed along at least a first axis extending at an acute angle from an edge of the IC die and intersecting the edge at a first point, the transceiver dies being configured to exchange the signals between the IC die and the other devices, and (iii) electrical connections configured to connect between the IC die and at least one of the transceiver dies for exchanging at least some of the signals between the IC die and the transceiver dies.

公开(公告)号：US20240405795A1

公开(公告)日：2024-12-05

申请号：US18801860

申请日：2024-08-13

Applicant: Marvell Asia Pte Ltd

Inventor： Aatreya Chakravarti ,  Wolfgang Sauter ,  Mark William Kuemerle ,  Eric William Tremble

IPC: H04B1/40 ,  H01L23/538 ,  H01L23/66

Abstract: An electronic network device includes: (i) an integrated circuit (IC) die disposed on a substrate and configured to exchange signals between the electronic network device and one or more other devices that are remote from the electronic network device, (ii) a plurality of transceiver dies disposed on the substrate and configured to transmit and receive the signals between the IC die and the other devices, one or more of the transceiver dies being spaced away from the IC die, and (iii) one or more decoupling capacitors configured to improve an integrity of one or more of the signals communicated within the electronic network device, the one or more decoupling capacitors being disposed in an area between the IC die and the one or more transceiver dies being spaced away from the IC die.

公开(公告)号：US20240258272A1

公开(公告)日：2024-08-01

申请号：US18421366

申请日：2024-01-24

Applicant: Marvell Asia Pte Ltd

Inventor： Aatreya Chakravarti ,  Mark William Kuemerle ,  Wolfgang Sauter ,  Carlos Macian Ruiz ,  John Edward Gregory, JR. ,  Eva Shah Holmes ,  Samer Michael Akiki

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/48 ,  H01L25/00

CPC classification number: H01L25/0652 ,  H01L23/481 ,  H01L25/50 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: An integrated circuit device includes a main integrated circuit die having functional circuitry configured to communicate over a network through one or more high-speed communications interfaces, and at least one secondary integrated circuit die including serial interface circuitry. Each integrated circuit die among the at least one secondary integrated circuit die is mounted on a first surface of the main integrated circuit die, and first metallization connections extend along one or more first through-silicon vias between the functional circuitry and the serial interface circuitry of the at least one secondary integrated circuit die. The first metallization connections may be configured to provide data from the main die to the secondary die, and the secondary die may be configured to communicate data between the integrated circuit device and a remote integrated circuit device. Second metallization connections extend between the serial interface circuitry of and terminals of the main integrated circuit die.