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    PACKAGED POWER MODULE
    2.
    发明申请
    PACKAGED POWER MODULE 有权

    公开(公告)号：US20210367526A1

    公开(公告)日：2021-11-25

    申请号：US17191816

    申请日：2021-03-04

    Applicant: Marel Power Solutions, Inc.

    Inventor： Jean-Claude Harel

    IPC: H02M7/00 ,  H02M7/53846 ,  H01L23/02 ,  H01L23/31 ,  H02B1/20 ,  H05K7/14 ,  H01L21/50

    Abstract: A packaged power module includes a case, and a metal structure that has first and second surfaces. A transistor is also included that has first and second terminals between which current is transmitted when the transistor is activated, and a control terminal controlling the transistor, wherein the first terminal is sintered to the first surface. A first opening through the case exposes the second surface.

    Fluid cooled inverter
    3.
    发明授权
    Fluid cooled inverter 有权

    公开(公告)号：US11967899B2

    公开(公告)日：2024-04-23

    申请号：US17191805

    申请日：2021-03-04

    Applicant: Marel Power Solutions, Inc.

    Inventor： Jean-Claude Harel

    IPC: H02M3/156 ,  H01L21/50 ,  H01L23/02 ,  H01L23/31 ,  H02B1/20 ,  H02K11/33 ,  H02M1/32 ,  H02M7/00 ,  H02M7/53846 ,  H05K7/14 ,  H05K7/20

    CPC classification number: H02M3/1563 ,  H01L21/50 ,  H01L23/02 ,  H01L23/31 ,  H02B1/20 ,  H02K11/33 ,  H02M1/32 ,  H02M7/003 ,  H02M7/538466 ,  H05K7/1432 ,  H05K7/209 ,  H02M1/327

    Abstract: A compact inverter system includes a bus bar. The bus bar includes a terminal for connection to a positive terminal of a DC voltage supply. The compact inverter also includes a heat sink, a first transistor, and a second transistor. The first transistor has first and second terminals between which current is transmitted when the first transistor is activated, and a first gate terminal controlling the first transistor. The first terminal of the first transistor is thermally and electrically connected to the bus bar. The second transistor has first and second terminals between which current is transmitted when the second transistor is activated, and a second gate terminal controlling the second transistor. The first terminal of the second transistor is thermally and electrically connected to the heat sink. The first and second transistors are positioned between the bus bar and the heat sink. The first transistor is positioned between the second transistor and the bus bar. The second transistor is positioned between the first transistor and the heat sink.

    COMPACT INVERTER SYSTEM
    4.
    发明申请
    COMPACT INVERTER SYSTEM 有权

    公开(公告)号：US20210367516A1

    公开(公告)日：2021-11-25

    申请号：US17191805

    申请日：2021-03-04

    Applicant: Marel Power Solutions, Inc.

    Inventor： Jean-Claude Harel

    IPC: H02M3/156 ,  H05K7/20 ,  H02M1/32 ,  H02K11/33

    Abstract: A compact inverter system includes a bus bar. The bus bar includes a terminal for connection to a positive terminal of a DC voltage supply. The compact inverter also includes a heat sink, a first transistor, and a second transistor. The first transistor has first and second terminals between which current is transmitted when the first transistor is activated, and a first gate terminal controlling the first transistor. The first terminal of the first transistor is thermally and electrically connected to the bus bar. The second transistor has first and second terminals between which current is transmitted when the second transistor is activated, and a second gate terminal controlling the second transistor. The first terminal of the second transistor is thermally and electrically connected to the heat sink. The first and second transistors are positioned between the bus bar and the heat sink. The first transistor is positioned between the second transistor and the bus bar. The second transistor is positioned between the first transistor and the heat sink.

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