Cluster tool apparatus and a method of controlling a cluster tool apparatus

    公开(公告)号:US10134613B2

    公开(公告)日:2018-11-20

    申请号:US15272706

    申请日:2016-09-22

    IPC分类号: H01L21/677 H01L21/67

    摘要: A system and method for a cluster tool apparatus for processing a semiconductor product including processing modules located adjacent each other and configured to process a semiconductor module, loadlocks configured to retain and dispense unprocessed semiconductor products and each positioned adjacent one of the processing modules, a robot configured to load, transfer and unload a semiconductor product to and from the processing modules, a hardware controller in communication with the robot and executing a method to close down the cluster tool apparatus to an idle state, the method including determining a status of the processing modules, determining if a close down process is required based on the status or based on a close down signal, and, if required, determining a schedule for a close down process based on a semiconductor product residency parameter, and controlling the operation of the robot based on the schedule to perform the close down process.

    CLUSTER TOOL APPARATUS AND A METHOD OF CONTROLLING A CLUSTER TOOL APPARATUS

    公开(公告)号:US20180082878A1

    公开(公告)日:2018-03-22

    申请号:US15272706

    申请日:2016-09-22

    IPC分类号: H01L21/677

    CPC分类号: H01L21/67167 H01L21/67745

    摘要: A system and method for a cluster tool apparatus for processing a semiconductor product including processing modules located adjacent each other and configured to process a semiconductor module, loadlocks configured to retain and dispense unprocessed semiconductor products and each positioned adjacent one of the processing modules, a robot configured to load, transfer and unload a semiconductor product to and from the processing modules, a hardware controller in communication with the robot and executing a method to close down the cluster tool apparatus to an idle state, the method including determining a status of the processing modules, determining if a close down process is required based on the status or based on a close down signal, and, if required, determining a schedule for a close down process based on a semiconductor product residency parameter, and controlling the operation of the robot based on the schedule to perform the close down process.