公开(公告)号：US09831579B1

公开(公告)日：2017-11-28

申请号：US15225155

申请日：2016-08-01

Applicant: MOTOROLA SOLUTIONS, INC.

Inventor： Alexander Gomelsky ,  Michael Astanovsky ,  Avihu Cohen ,  Guy Shimon

IPC: H01R12/00 ,  H01R12/71 ,  H01R13/6581 ,  H01R13/719 ,  H01R43/26

CPC classification number: H01R12/716 ,  H01R12/52 ,  H01R12/7076 ,  H01R13/6594 ,  H01R13/719

Abstract: A method and apparatus for board-to-board circuit connection. In one example, a connector system includes a printed circuit board having a first set of electrical pads and at least one electrical component positioned between the first set of electrical pads and an adapter frame. The adapter frame includes a second set of electrical pads on a bottom surface and connected to the first set of electrical pads of the printed circuit board and a third set of electrical pads on a top surface and electrically connected to the second set of electrical pads. The adapter frame further includes a chamber configured to house the at least one electrical component and having electrical shielding that forms at least a partial Faraday cage around the at least one electrical component. A connector receptacle having a set of pins is connected to the third set of electrical pads.