公开(公告)号：US3748543A

公开(公告)日：1973-07-24

申请号：US3748543D

申请日：1971-04-01

Applicant: MOTOROLA INC

Inventor： ROBERSON D

IPC: H01L23/057 ,  H01L23/10 ,  H01L23/535 ,  H01L5/02

CPC classification number: H01L23/10 ,  H01L23/057 ,  H01L23/535 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01L2924/00014

Abstract: There is disclosed a hermetically sealed semiconductor package which is physically thin, allowing mounting within apertures formed in printed circuit boards which are stacked one on top of another in a high density configuration. The hermetic seal is made to a planar surface resulting in high reliability devices in which the leads to the interior of the package are made through ''''cross under'''' regions which are provided with planar top surfaces. The ''''cross under'''' region is a region of extremely low resistivity, high temperature material. Because this material is utilized as part of the lead to the device and because the hermetic seal is made on top of the ''''cross under,'''' higher temperatures, which would ordinarily destroy metal leads, can be applied to the sealing material both on top of the ''''cross unders'''' and on top of the substrate for increasing the reliability of the seal. This package replaces the more fragile prior art hermetically sealed devices which include a number of piece parts. A device packaged in the subject manner is also used as a hermetically sealed substitute for beam lead devices, since the subject devices are thin, have a higher reliability than unsealed beam lead devices and are impervious to welding and other contaminants during mounting.

Abstract translation: 公开了一种物理上薄的密封半导体封装，允许安装在以高密度配置堆叠在另一个之上的印刷电路板中形成的孔内。 气密密封件制成平面表面，导致高可靠性的装置，其中通过设置有平坦顶表面的“交叉”的区域制造通向包装内部的引线。 “交叉”区域是极低电阻率，高温材料的区域。 因为这种材料被用作引导装置的一部分，并且由于气密密封是在“交叉下方”的顶部制成的，因此通常会破坏金属引线的较高温度可以施加到密封材料上 “交叉下”和衬底顶部，以提高密封的可靠性。