公开(公告)号：US12221569B2

公开(公告)日：2025-02-11

申请号：US17440049

申请日：2019-10-30

Applicant: MODU TECH CO., LTD.

Inventor： Byeong Yeon Choi ,  Seung Yol Lee ,  Suk Hee Kang ,  Gyung Ju Yoon

IPC: C09J7/29 ,  C09J7/30 ,  C09J7/40 ,  C09J7/50 ,  C09J183/06 ,  H01L23/482

Abstract: Provided is an adhesive tape for a semiconductor package manufacturing process. The adhesive type includes: a first adhesive layer formed on a first base film; a second base film formed on the first adhesive layer, in which the second base film changes its shape to conform to the topology of the semiconductor package bottom surface when the adhesive tape is attached to the semiconductor package bottom surface, and containing a metal element so as to independently maintain the changed shape during the process; and a second adhesive layer formed on the second base film, the second adhesive layer having a smaller thickness than the first adhesive layer and having a lower adhesive strength than the first adhesive layer, wherein each of the first adhesive layer and the second adhesive layer has a spiral network molecular structure and includes a first adhesive composition containing silicone.