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1.
公开(公告)号:US20230250276A1
公开(公告)日:2023-08-10
申请号:US18006762
申请日:2022-02-24
Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
Inventor: Shuta ISEKI , Hidekazu SHOJI
CPC classification number: C08L67/03 , C08K3/041 , C08L25/06 , C08L77/00 , C08L23/06 , C08L23/12 , C08L2310/00 , C08L2203/20
Abstract: A resin composition including a thermoplastic resin and a carbon nanotube. The resin composition has a dielectric constant at 76.5 GHz frequency of 4.50 or larger. A method for producing the resin composition, the method including, melt-kneading the thermoplastic resin, and a masterbatch of the carbon nanotube in the thermoplastic resin.
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公开(公告)号:US20230323111A1
公开(公告)日:2023-10-12
申请号:US18006749
申请日:2022-02-24
Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
Inventor: Shuta ISEKI , Hidekazu SHOJI , Satomi KITAGAWA
CPC classification number: C08L67/02 , B29C48/022 , C08K3/041 , B29K2067/006 , C08K2201/001 , C08L2310/00
Abstract: A resin composition, a formed article, and, an electromagnetic wave absorber, may each have large electromagnetic wave absorbance. The resin composition may contain: a thermoplastic resin; and an electro-conductive substance, the resin composition, when formed to a 2 mm thick test specimen and a cross section thereof is observed under a digital microscope, giving an aggregate attributable to the electro-conductive substance, with an area percentage of the aggregate, having an equivalent circle diameter of 30 µm or larger, of 0.80% or smaller.
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3.
公开(公告)号:US20230242747A1
公开(公告)日:2023-08-03
申请号:US18001812
申请日:2021-06-16
Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
Inventor: Shuta ISEKI , Hidekazu SHOJI
CPC classification number: C08L23/12 , C08K13/00 , G01N22/00 , C08L2201/02
Abstract: A resin composition containing, per 100 parts by mass of a thermoplastic resin, 0.1 to 10.0 parts by mass of a carbon nanotube, and 10 to 100 parts by mass of a glass fiber, with a mass proportion of the carbon nanotube and the glass fiber (carbon nanotube/glass fiber) being 0.01 to 0.30.
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公开(公告)号:US20230340252A1
公开(公告)日:2023-10-26
申请号:US18001801
申请日:2021-06-16
Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATION
Inventor: Shuta ISEKI , Hidekazui SHOJI
CPC classification number: C08L67/02 , C08K3/041 , C08K7/06 , C08K7/14 , H05K9/0081 , C08L2201/02 , C08L2203/20 , C08L2205/035
Abstract: A resin composition for electromagnetic wave absorber may have large absorbance of electromagnetic wave, small transmittance and reflectance of electromagnetic wave, and small variation of reflectance depending on frequency of electromagnetic wave. An electromagnetic wave absorber may use such a composition. The resin composition may contain 0.1 to 10.0 parts by mass of an electromagnetic wave absorbing material, per 100 parts by mass of a thermoplastic resin, demonstrating an absorbance at 76.5 GHz frequency of 40.0 to 100%, when formed to a size of 150 mm×150 mm×2 mm thick and determined by Equation (A); demonstrating a difference between the maximum and minimum value of reflectance in the range from 70 GHz to 80 GHz frequency of 20.0% or smaller, when formed to a size of 150 mm×150 mm×2 mm thick and determined by Equation (B); and being suited for use as an electromagnetic wave absorber.
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