公开(公告)号：US20240162154A1

公开(公告)日：2024-05-16

申请号：US18054637

申请日：2022-11-11

申请人： MICRON TECHNOLOGY, INC.

发明人： KEIICHI TSUCHIYA ,  KEIZO KAWAKITA

IPC分类号： H01L23/535 ,  H01L21/768 ,  H01L23/528 ,  H01L23/532

CPC分类号： H01L23/535 ,  H01L21/76805 ,  H01L21/7684 ,  H01L21/76846 ,  H01L21/76865 ,  H01L21/76895 ,  H01L23/5283 ,  H01L23/53238 ,  H01L23/53266

摘要： An apparatus that includes a first conductive pattern positioned at a first wiring layer and extending in a first direction, a second conductive pattern positioned at a second wiring layer located above the first wiring layer and extending in a second direction crossing the first direction, and a contact plug connecting the first conductive pattern with the second conductive pattern. The contact plug includes a lower conductive section contacting the first conductive pattern and an upper conductive section contacting the second conductive pattern. A maximum width of the upper conductive section in the first direction is smaller than a maximum width of the lower conductive section in the first direction.