公开(公告)号：US20230307316A1

公开(公告)日：2023-09-28

申请号：US18116258

申请日：2023-03-01

Applicant: MEDIATEK INC.

Inventor： Chin-Lai Chen ,  Wei-Che Huang ,  Wen-Sung Hsu ,  Chun-Yin Lin ,  Li-Song Lin ,  Tai-Yu Chen

IPC: H01L23/427 ,  H01L23/16 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/427 ,  H01L23/16 ,  H01L25/0655 ,  H01L24/16 ,  H01L24/32 ,  H01L2924/182 ,  H01L2224/16225 ,  H01L2224/32245

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface. A semiconductor device is mounted on the top surface of the substrate. The semiconductor device has an active front surface directly facing the substrate, and an opposite rear surface. A vapor chamber lid is in thermal contact with the rear surface of the semiconductor device. The vapor chamber lid includes an internal vacuum-sealed cavity that stores a working fluid, and wick structures for recirculating the working fluid within the internal vacuum-sealed cavity.