公开(公告)号：US12074123B2

公开(公告)日：2024-08-27

申请号：US17031745

申请日：2020-09-24

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： Richard Wilson ,  Madhu Chidurala

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H01L25/18

CPC classification number: H01L23/66 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/08 ,  H01L24/48 ,  H01L25/18 ,  H01L2223/6672 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/16145 ,  H01L2224/48137 ,  H01L2224/48157

Abstract: A multi-level radio frequency (RF) integrated circuit component includes an upper level including at least one inductor, and a lower level including at least one conductive element that provides electrical connection to the at least one inductor. The lower level separates the at least one inductor from a lower surface that is configured to be attached to a conductive pad. Related integrated circuit device packages are also discussed.