PHOTONIC INTEGRATED CIRCUIT SYSTEM AND METHOD OF FABRICATION

    公开(公告)号:US20220269002A1

    公开(公告)日:2022-08-25

    申请号:US17671049

    申请日:2022-02-14

    Abstract: A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

    Optical computing system and method of use

    公开(公告)号:US12045080B1

    公开(公告)日:2024-07-23

    申请号:US17170794

    申请日:2021-02-08

    CPC classification number: G06E3/005 G06E3/006 G06E3/008

    Abstract: An optical computation system, preferably including an optical source, a splitter, and one or more phase accumulator banks. A phase accumulator bank, preferably including two optical paths, a plurality of phase accumulator units, and a detector module, and optionally including one or more compensation phase shifters. A method, preferably including receiving one or more optical inputs, receiving one or more electrical inputs, controlling one or more phase accumulator units based on the electrical inputs, and generating one or more electrical outputs based on optical signals.

    OPTICAL LINK SYSTEM AND METHOD FOR COMPUTATION

    公开(公告)号:US20240223923A1

    公开(公告)日:2024-07-04

    申请号:US18608302

    申请日:2024-03-18

    CPC classification number: H04Q11/0005 H04B10/25

    Abstract: An optical link system for computation, preferably including a photonics substrate and a plurality of electronics modules, such as processors, memory controllers, and/or switches, which are preferably bonded to the photonics substrate. A photonics substrate, preferably including a plurality of optical links including waveguides and optical transducers. A method for optical link system operation, preferably including operating electronics modules and using optical links, optionally in cooperation with electronics modules such as switches, to transfer information between the electronics modules.

    Optical link system and method for computation

    公开(公告)号:US11490177B1

    公开(公告)日:2022-11-01

    申请号:US17337289

    申请日:2021-06-02

    Abstract: An optical link system for computation, preferably including a photonics substrate and a plurality of electronics modules, such as processors, memory controllers, and/or switches, which are preferably bonded to the photonics substrate. A photonics substrate, preferably including a plurality of optical links including waveguides and optical transducers. A method for optical link system operation, preferably including operating electronics modules and using optical links, optionally in cooperation with electronics modules such as switches, to transfer information between the electronics modules.

    Photonic integrated circuit system and method of fabrication

    公开(公告)号:US12007603B2

    公开(公告)日:2024-06-11

    申请号:US18176861

    申请日:2023-03-01

    CPC classification number: G02B6/12019 G02B6/132 G02B6/136 G02B2006/12061

    Abstract: A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

    Optical link system and method for computation

    公开(公告)号:US11937030B2

    公开(公告)日:2024-03-19

    申请号:US17953590

    申请日:2022-09-27

    CPC classification number: H04Q11/0005 H04B10/25

    Abstract: An optical link system for computation, preferably including a photonics substrate and a plurality of electronics modules, such as processors, memory controllers, and/or switches, which are preferably bonded to the photonics substrate. A photonics substrate, preferably including a plurality of optical links including waveguides and optical transducers. A method for optical link system operation, preferably including operating electronics modules and using optical links, optionally in cooperation with electronics modules such as switches, to transfer information between the electronics modules.

    PHOTONIC INTEGRATED CIRCUIT SYSTEM AND METHOD OF FABRICATION

    公开(公告)号:US20240280748A1

    公开(公告)日:2024-08-22

    申请号:US18651273

    申请日:2024-04-30

    CPC classification number: G02B6/12019 G02B6/132 G02B6/136 G02B2006/12061

    Abstract: A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

    OPTICAL MODULATOR WITH TWISTED ELECTRODES
    8.
    发明公开

    公开(公告)号:US20240210783A1

    公开(公告)日:2024-06-27

    申请号:US18069251

    申请日:2022-12-21

    CPC classification number: G02F1/212 G02F1/0121 G02F1/025 G02F1/2255

    Abstract: A significant challenge occurs when two Mach-Zehnder optical modulators are placed in close proximity next to one another, resulting in substantial cross talk. An optical modulator configured to reduce crosstalk between adjacent optical modulators includes a positive polarity signal electrode electrically coupled between a driver and an optical phase shifting section, and a negative polarity signal electrode electrically. The positive polarity signal electrode comprises a first positive polarity signal electrode section extending adjacent to a first optical waveguide path, and a second positive polarity signal electrode section extending adjacent to a second optical waveguide path. The negative polarity signal electrode comprises a first negative polarity signal electrode section extending adjacent to the second optical waveguide path and the first positive polarity signal electrode section, and a second negative polarity signal electrode section extending adjacent to the first optical waveguide path and the second positive polarity electrode section.

    PHOTONIC INTEGRATED CIRCUIT SYSTEM AND METHOD OF FABRICATION

    公开(公告)号:US20230204858A1

    公开(公告)日:2023-06-29

    申请号:US18176861

    申请日:2023-03-01

    CPC classification number: G02B6/12019 G02B6/132 G02B6/136 G02B2006/12061

    Abstract: A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

    Photonic integrated circuit system and method of fabrication

    公开(公告)号:US11609375B2

    公开(公告)日:2023-03-21

    申请号:US17671049

    申请日:2022-02-14

    Abstract: A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

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