PHOTONIC INTEGRATED CIRCUIT SYSTEM AND METHOD OF FABRICATION

    公开(公告)号:US20220269002A1

    公开(公告)日:2022-08-25

    申请号:US17671049

    申请日:2022-02-14

    Abstract: A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

    Photonic integrated circuit system and method of fabrication

    公开(公告)号:US12007603B2

    公开(公告)日:2024-06-11

    申请号:US18176861

    申请日:2023-03-01

    CPC classification number: G02B6/12019 G02B6/132 G02B6/136 G02B2006/12061

    Abstract: A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

    PHOTONIC INTEGRATED CIRCUIT SYSTEM AND METHOD OF FABRICATION

    公开(公告)号:US20240280748A1

    公开(公告)日:2024-08-22

    申请号:US18651273

    申请日:2024-04-30

    CPC classification number: G02B6/12019 G02B6/132 G02B6/136 G02B2006/12061

    Abstract: A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

    PHOTONIC INTEGRATED CIRCUIT SYSTEM AND METHOD OF FABRICATION

    公开(公告)号:US20230204858A1

    公开(公告)日:2023-06-29

    申请号:US18176861

    申请日:2023-03-01

    CPC classification number: G02B6/12019 G02B6/132 G02B6/136 G02B2006/12061

    Abstract: A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

    Photonic integrated circuit system and method of fabrication

    公开(公告)号:US11609375B2

    公开(公告)日:2023-03-21

    申请号:US17671049

    申请日:2022-02-14

    Abstract: A photonic integrated circuit (PIC) system, preferably including a substrate, one or more photonic connections, and a plurality of circuit blocks. The circuit blocks preferably include one or more waveguides that are optically coupled to the photonic connections, such as by transition features. A method of PIC fabrication, preferably including defining a PIC structure and defining circuit blocks. The circuit blocks are preferably defined onto one or more template regions defined by the PIC structure. Photonic connections are preferably defined as part of the PIC structure. Transition features, such as transitions between the photonic connections and the circuit blocks, are preferably defined concurrently with defining the circuit blocks.

Patent Agency Ranking