公开(公告)号：US20170222395A1

公开(公告)日：2017-08-03

申请号：US15421210

申请日：2017-01-31

Applicant: Lumentum Operations LLC

Inventor： Yonghong GUO ,  Jay A. SKIDMORE ,  Xia HONG ,  John MARTINHO ,  Huijie XU ,  Lihua WANG ,  Yaogeng DING ,  Nicolas GUERIN

IPC: H01S5/022 ,  H01S5/12

CPC classification number: H01S5/02288 ,  H01S5/005 ,  H01S5/02 ,  H01S5/02212 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/12 ,  H01S5/141

Abstract: A pump laser package may include an input fiber to send signal light on a first optical path. A first lens may be arranged on the first optical path. The pump laser package may include a source to send pump light on a second optical path. A second lens and a negative lens may be arranged on the second optical path. The first lens and the negative lens may be arranged to create a virtual image associated with the pump light. The pump laser package may include an output fiber on a third optical path. The first lens may be arranged on the third optical path. The pump laser package may include a combiner to receive the signal light on the first optical path, receive the pump light on the second optical path, and send the signal light and the pump light on the third optical path.

公开(公告)号：US20210063657A1

公开(公告)日：2021-03-04

申请号：US16700121

申请日：2019-12-02

Applicant: Lumentum Operations LLC

Inventor： Frank WU ,  Prasad YALAMANCHILI ,  Raman SRINIVASAN ,  Huijie XU

IPC: G02B6/42 ,  C09J163/00 ,  C09J5/00

Abstract: A fiber attachment structure may comprise a monolithic platform structure having a first trench and a second trench to segment the monolithic platform structure into a chip mount area, a first island, and a second island. A laser chip may be mounted directly on the chip mount area and an optical fiber may be mounted on the first island by a first adhesive joint and on the second island by a second adhesive joint. For example, in some implementations, the first adhesive joint may include a first quantity of adhesive material attaching the optical fiber to the first island at a position at which a tip of the optical fiber is aligned with an output facet of the laser chip, and the second adhesive joint may include a second quantity of the adhesive material to mechanically secure the optical fiber to the second island.