Controlling one or more electrostatic comb structures of a micro-electro-mechanical system device

    公开(公告)号:US12116267B2

    公开(公告)日:2024-10-15

    申请号:US17538784

    申请日:2021-11-30

    CPC classification number: B81B3/0059 G02B26/0841 B81B2203/0136

    Abstract: A micro-electro-mechanical system (MEMS) device includes a mirror; at least one hinge; an electrostatic comb structure; and a control device. The control device causes, for a period of time, a voltage to be supplied to the electrostatic comb structure to cause the electrostatic comb structure to tilt the mirror about the at least one hinge in a particular direction. The control device causes, after the period of time and at an instant of time, the voltage to cease being supplied to the electrostatic comb structure. A tilt angle of the mirror, at the first instant of time, is less than a maximum tilt angle of the mirror in the particular direction. An angular momentum of the mirror, at the instant of time, is greater than zero kilogram meters squared per second in the particular direction.

    Liquid crystal on silicon panel with electrically-conductive adhesive

    公开(公告)号:US11906852B2

    公开(公告)日:2024-02-20

    申请号:US17810080

    申请日:2022-06-30

    Abstract: In some implementations, a liquid crystal on silicon panel includes a backplane with an electrical contact formed on the backplane, a first alignment layer disposed on the backplane and interfacing with the electrical contact, a conductive layer that is light transmissive, a second alignment layer disposed on the conductive layer, and a plurality of beads in an electrically-conductive adhesive between the first alignment layer and the second alignment layer. Electrically-conductive particles within the electrically-conductive adhesive may make the electrically-conductive adhesive electrically-conductive. A first set of the electrically-conductive particles may puncture the first alignment layer to contact the electrical contact, and a second set of the electrically-conductive particles may puncture the second alignment layer to contact the conductive layer. An electrical connection of the electrical contact and the conductive layer may be via a plurality of the electrically-conductive particles.

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